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Piezoelectrically-driven jet type glue dispensing device

A technology of piezoelectric driving and dispensing device, which is applied to devices and coatings that apply liquid to the surface, and can solve the problems that the dispensing speed and accuracy need to be improved, and the dispensing volume cannot be adjusted online.

Active Publication Date: 2015-03-18
HARBIN INST OF TECH AT WEIHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the problem that the dispensing speed and precision of the existing jet dispensing device need to be improved, and the dispensing volume cannot be adjusted online, and provide a kind of composition, reasonable structure, reliable connection, fast dispensing speed, high precision, Piezoelectric drive-based jet dispensing device with flexible on-line adjustment of glue dispensing volume

Method used

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  • Piezoelectrically-driven jet type glue dispensing device
  • Piezoelectrically-driven jet type glue dispensing device
  • Piezoelectrically-driven jet type glue dispensing device

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Embodiment Construction

[0018] From figure 1 It can be seen that a jet-type glue dispensing device based on piezoelectric driving includes a piezoelectric driving mechanism 1, a jetting mechanism 2, a glue delivery mechanism 3, and a supporting connecting frame 4.

[0019] From figure 2 , image 3 , Figure 4 , Image 6 It can be seen that the piezoelectric driving mechanism 1 of the present invention includes a diamond-shaped amplification module 1-1, a piezoelectric actuator 1-2, an adjusting nut 1-3, a spring 1-4, and a striker 1-5.

[0020] The upper part of the diamond-shaped amplification module 1-1 is connected to the supporting connection frame 4, and is screwed together through the strip hole 4-1 on the supporting connection frame and the threaded hole at the upper end of the diamond-shaped amplification module 1-1, such as image 3 , Figure 4 Shown. The lower part of the diamond-shaped amplifier module 1-1 is connected with the striker 1-5, and screwed together with the striker 1-5 through the ...

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Abstract

The invention relates to a piezoelectrically-driven jet type glue dispensing device. The piezoelectrically-driven jet type glue dispensing device comprises a piezoelectric driving mechanism, a jet mechanism, a glue solution delivery mechanism and a supporting connecting frame, wherein a piezoelectric actuator of the piezoelectric driving mechanism is fixed between left and right end faces inside a rhombic amplification module; and the upper end of the rhombic amplification module is fixedly connected with the supporting connecting frame, and the lower end of the rhombic amplification module is fixedly connected with the upper end face of a pin. The piezoelectric actuator drives the pin to vibrate at high frequency to drive a glue solution to be sprayed out of a nozzle, and the distribution speed and volume of the glue solution can be regulated in real time by changing the frequency and amplitude of an electric signal exciting the piezoelectric actuator. The piezoelectrically-driven jet type glue dispensing device is an ideal jet type glue dispensing device which is reasonable in composition and structure, reliable in connection, high in distribution speed and high in accuracy. The distribution volume of the glue solution can be flexibly adjusted on line. The piezoelectrically-driven jet type glue dispensing device is applied to the occasions where glue is required to be precisely, quickly and flexibly dispensed for microelectronic packaging, chip manufacturing and the like.

Description

Technical field [0001] The invention relates to a spray type glue dispensing device, in particular to a spray type glue dispensing device based on piezoelectric drive. Background technique [0002] In the field of electronic packaging, the rapid and accurate distribution and transfer of various colloidal materials is one of the necessary means to realize chip bonding and flip-chip packaging. At present, the commonly used glue dispensing method is contact dispensing, that is, the glue drop attached to the needle tip is brought into contact with the substrate by moving the dispensing device in the Z direction to realize the transfer of the glue to the substrate. Existing contact dispensing devices mainly include pneumatic direct drive type and pneumatic switch type. The pneumatic direct drive type glue dispensing device uses high-pressure air to directly drive the glue out of the device. The dispensing process is particularly sensitive to factors such as pressure fluctuations, res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/00B05C11/10
Inventor 刘亚欣黄博路士州姚玉峰
Owner HARBIN INST OF TECH AT WEIHAI
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