Solder mask printing method of thick copper plate

Abstract

The invention discloses a solder mask printing method of a thick copper plate. The solder mask printing method of the thick copper plate includes a first step of respectively manufacturing a copper layer area screen printing plate and a whole plate surface screen printing plate according to a area, covered with the copper layer, of the surface of a circuit board and the surface of the whole of the circuit board; a second step of covering ink on the circuits and a copper surface on the surface of the circuit board through the copper layer area screen printing plate; a third step of standing the circuit board; a fourth step of baking the circuit board; a fifth step of coating ink on the whole surface of the circuit board through the whole plate surface screen printing plate; a sixth step of standing the circuit board again; and a seventh step of baking the circuit board again. The solder mask printing method of the thick copper plate improves the thickness of the ink on the copper layer area of the thick copper plate and improves the phenomena that edge of circuits appears red and the ink accumulates in holes.

Description

technical field [0001] The invention relates to the technical field of PCB thick copper plate manufacturing, in particular to a thick copper plate solder resist printing method. Background technique [0002] In the manufacturing process of the circuit board, after the outer layer pattern is made, the outer layer pattern and some through holes on the outer layer pattern must be protected against soldering to prevent the outer layer pattern from being oxidized or soldered. The outer pattern includes: the circuit formed on the copper layer coverage area, the copper surface, and the copper-free area not covered by the copper layer. At present, when printing ink on the surface of circuit boards, technicians in this industry usually use the same screen to print the copper layer area and the copper-free area as a whole. , there are more quality defects. For this kind of thick-surface copper structure circuit board, when the traditional overall printing method is still used, due t...

AI Technical Summary

Problems solved by technology

In order to increase the thickness of the ink in the copper layer area, those skilled in the art try to increase the intensity of printing, but this method leads to a significant reduction in printing efficiency, and makes the ink flow into the holes that do not need to be plugged. After baking, the ink remaining on the hole wall becomes hardened and difficult to be completely removed during development, thus affecting the functionality of the circuit board