Solution and method for removing flash

Abstract

The invention relates to a solution for removing flash, which comprises the following components in percentage by mass: 10-60% of 1,3-dimethyl-2-imidazolidinone, 10-30% of ethanolamine, 10-60% of hexamethyl phosphoric triamide and 0-10% of deionized water. The ethanolamine is monoethanolamine, diethanolamine or triethanolamine. Particularly, the solution comprises the following components in percentage by mass: 30% of 1,3-dimethyl-2-imidazolidinone, 30% of monoethanolamine, 35% of hexamethyl phosphoric triamide and 5% of deionized water. The invention also relates to a method for removing flash, which comprises the following steps: corroding metal under flash by using the prepared solution, and when the combination of the metal under flash and the flash becomes loose, removing the flash in a mechanical mode. All the components can be dissolved in water, and thus, the solution is easy to clean; the solution is weakly alkaline, and thus, can not discolor the packaged colloid; the application temperature is high, and thus, the operation can be performed at 50-110 DEG C; the solution can be used for treating the product with severe flash only by enhancing the soaking temperature or prolonging the soaking time; and the invention can be used for removing oxides on the substrate surface without excessively corroding the substrate.

Description

Technical field [0001] The invention relates to a solution and a method for removing flashes generated in the process of integrated circuit packaging, in particular to a solution for removing plastic packaging flashes (including packaging overflow glue, silicone oil, wax) and a method for removing flashes . Background technique [0002] According to data, more than 90% of transistors and 70-80% of integrated circuits are packaged with plastic packaging materials. Due to the large deviation of the processing size of the plastic packaging mold and the large size deviation of the new mold with the wear during use, the plastic packaging material overflows from the mold gap during the plastic packaging process. This spilled plastic material is called flash. Flash material includes molding material and release agent. Flash is formed on the pins and metal heat dissipation surfaces of semiconductor devices, covers or wraps the pins and heat dissipation surfaces, and affects the appea...

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that high-temperature immersion in inorganic alkali can easily cause chemical reactions in the plastic package, making the surface loose and discolored

Electrolysis is likely to cause a decrease in the bonding force between the plastic package and the integrated circuit, affecting the stability of the device's performance