High-density through-hole metal foam heat sink for electronic devices based on impinging jet

Abstract

A high-hole-density through hole metal foam electronic element heat-exchanging device based on impact jet flow comprises a heat-exchanging substrate, through hole metal foam sintered on the heat-exchanging substrate, a cooling water inlet pipe and a water drainage pipe, wherein main bodies of the cooling water inlet pipe and the water drainage pipe are vertical arranged at intervals, heat-exchanging parts at the bottoms of the two water pipes are provided with the through hole metal foam, and a heat-exchanging structure is arranged in the position wherein the through hole metal foam is connected with the water drainage pipe. According to the high-hole-density through hole metal foam electronic element heat-dissipation device based on the impact jet flow, the through hole metal foam is used for separating the flowing route of supplement liquid and the escape route of bubbles, and largely reduces the resistance when the bubbles escape. The heat-exchanging device is high in heat-exchanging efficiency, and is capable of being widely used in the heat-exchanging field of electronic elements.

Description

technical field [0001] The invention relates to a cooling device in the field of electronic devices, in particular to a high-pore-density through-hole metal foam heat sink for electronic devices based on impinging jets. Background technique [0002] With the development of the electronic industry, the performance of electronic devices is getting higher and higher, and their heating power is also increasing rapidly. The maximum heating power of current electronic chips has exceeded 100W / cm 2 , and is still increasing rapidly. Impingement jet heat transfer is an efficient heat transfer method, and its heat transfer coefficient is 1-2 orders of magnitude higher than that of ordinary natural convection heat transfer. The boiling heat transfer coefficient is 1-2 orders of magnitude higher than that of single-phase heat transfer. High pore density (100PPI-130PPI) through-hole metal foam is a kind of high porosity (0.88-0.98), high specific surface area (10000-13000m 2 / m 3 ) ...

AI Technical Summary

Problems solved by technology

However, the specific heat capacity of the refrigerant is small, so the overall heat transfer coefficient of the device is low

Moreover, the refrigerant is easy to leak and pollute the environment.

[0005] In summary, although the existing technology has improved the heat transfer efficiency of the electronic chip cooling device, it cannot make full use of the heat transfer performance of the through-hole metal foam, especially the high-density through-hole metal foam.

The advantages of high-density through-hole metal foam with large specific surface area and strong flow-disturbing ability have not been brought into play

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