Novel anode plate and die thereof

Abstract

The invention discloses a novel anode plate which comprises a copper plate layer and a main plate, wherein the surface of the copper plate layer is provided with a plurality of bulges; and insulting nails are arranged on the main plate of the copper plate layer. The inner wall surfaces of the copper plate layer and the die are provided with the plurality of bulges; and compared with the smooth surface of a copper plate layer, the inner wall surface with the bulges of the copper plate layer can be used for enlarging the contact area between the copper plate layer and electrolyte and improving the reaction rate and the production efficiency of electrolytic copper. The insulating nails are arranged on the surface of the copper plate layer, and thus the anode plate can be subjected to insulating protection.

Description

technical field [0001] The invention belongs to the technical field of electrolysis equipment, and in particular relates to a novel anode plate and a mold thereof. Background technique [0002] The anode plate is made of blister copper (copper content is about 99%). During electrolysis of copper, the blister copper on the anode plate dissolves into copper ions and moves to the cathode. After reaching the cathode, electrons are obtained and pure copper is precipitated at the cathode. Existing All the anode plates are smooth surface, and the electrochemical reaction is carried out on the surface of the anode plate, if it is only a smooth surface, the contact area with the electrolyte is small, the reaction rate is slow, and the production efficiency is low. Contents of the invention [0003] The technical problem to be solved by the invention is to provide a new anode plate and its mold, which can accelerate the reaction rate of electrolytic copper. [0004] In order to sol...

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Problems solved by technology

[0002] The anode plate is made of blister copper (copper content is about 99%). During electrolysis of copper, the blister copper on the anode plate dissolves into copper ions and moves to the cathode. After reaching the cathode, electrons are obtained and pure copper is precipitated at the cathode. Existing The anode plates are all smooth surfaces, and the electrochemical reaction is carried out on the surface of the anode plates. If it is only a smooth surface, the contact area with the electrolyte is small, the reaction rate is slow, and the production efficiency is low.

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