A bonding machine device and a bonding alignment method

Abstract

The invention relates to a bonding technology for semiconductor manufacture, in particular to a bonding machine device and a bonding alignment method. The bonding alignment method comprises the following steps of: aligning a top alignment camera and a bottom alignment camera with a standard alignment identifier respectively; aligning a top chuck alignment identifier with the bottom alignment camera, and aligning a bottom chuck alignment identifier with the top alignment camera; aligning a top wafer alignment identifier with the top chuck alignment identifier; aligning a bottom wafer alignment identifier with the bottom chuck alignment identifier; aligning the top wafer alignment identifier with the bottom alignment camera, and aligning the bottom wafer alignment identifier with the top alignment camera; and bonding a top wafer and a bottom wafer, which are aligned. According to the bonding machine device and the bonding alignment method, an unknown parameter that whether chucks are aligned or not is substantially eliminated, so that the wafers can be aligned more accurately to solve the problems of low image sensor yield and long alignment time caused by low alignment degree in a bonding process, further improve the yield of an image sensor, reduce the time of the whole bonding process and improve the production efficiency.

Description

Technical field [0001] The invention relates to semiconductor manufacturing bonding technology, and specifically relates to a bonding machine device and a bonding alignment method. Background technique [0002] In the back-illuminated image sensor manufacturing process, steps such as adding a metal shielding layer and a filter are required after the device wafer is bonded to the logic wafer and after the backside of the device wafer is thinned. The backside thinning process will cause the problem of removing the alignment marks on the device wafer, which will affect the accuracy of photolithography. The maximum allowable error of plus or minus fifty microns in mechanical alignment may cause errors in the photolithography machine, which may cause errors. This has largely caused the loss of image sensor yield and increased process time. [0003] The alignment method in the prior art is to first align the top alignment camera and the top alignment camera with the standard alig...

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a bonding machine device and a bonding alignment method to solve the problem of low alignment in the bonding process in the prior art, which leads to low yield rate of image sensors and long alignment time. question

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