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A kind of preparation method of organosilicon oligomer for high-power LED encapsulation

A LED packaging and silicone technology, applied in the chemical field, can solve the problems of reducing polycondensation and cyclization reactions of phenyl monomers, cumbersome operations, and many steps

Inactive Publication Date: 2015-11-18
YANTAI DEBANG ADVANCED SILICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method has many steps and is cumbersome to operate, and an excessive amount of disiloxane monomer needs to be used to reduce the polycondensation and cyclization reaction of the phenyl monomer itself.

Method used

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  • A kind of preparation method of organosilicon oligomer for high-power LED encapsulation
  • A kind of preparation method of organosilicon oligomer for high-power LED encapsulation
  • A kind of preparation method of organosilicon oligomer for high-power LED encapsulation

Examples

Experimental program
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Effect test

Embodiment 1

[0050] Into a 500mL three-necked flask equipped with a constant pressure funnel, a thermometer, a magnetic stirring and a distillation device, sequentially add 118.21g of hydrogen dimethylacetoxysilane, 200mL of toluene and 0.1g of trifluoromethanesulfonic acid, and raise the temperature to 50°C under stirring After 30 minutes, add 91.15 g of methylphenyldimethoxysilane dropwise to the reaction flask with a constant pressure funnel. After the dropwise addition, continue to stir and react for 1 hour, then raise the temperature to 80° C. and distill off the low boiling point liquid. After cooling to room temperature, wash with deionized water to neutrality, and rotary evaporate to obtain 130.07 g of a colorless transparent liquid with the structure shown in the following formula, with a yield of 96.2%.

[0051]

Embodiment 2

[0053]To a 500mL three-necked flask equipped with a constant pressure funnel, a thermometer, a magnetic stirring and a distillation device, sequentially add 144.25g of vinyldimethylacetoxysilane, 200mL of toluene and 0.1g of trifluoromethanesulfonic acid, and heat up to 50 °C, add 91.15g of methylphenyldimethoxysilane dropwise to the reaction flask with a constant pressure funnel over 30 minutes, after the dropwise addition, continue to stir for 1 hour, then raise the temperature to 80°C to distill off the low boiling point liquid. After cooling to room temperature, wash with deionized water until neutral, and rotary evaporate to obtain 153.89 g of a colorless transparent liquid with the structure shown in the following formula, with a yield of 95.4%.

[0054]

Embodiment 3

[0056] Into a 500mL three-neck flask equipped with a constant pressure funnel, thermometer, magnetic stirring and distillation device, add 141.85g of hydrogen dimethylacetoxysilane, 200mL of toluene and 0.1g of trifluoromethanesulfonic acid in sequence, and raise the temperature to 50°C under stirring After 30 minutes, 79.32 g of phenyltrimethoxysilane was added dropwise to the reaction flask with a constant pressure funnel. After the dropwise addition, the stirring reaction was continued for 1 hour, and the temperature was raised to 80° C. to distill off the low boiling point liquid. After cooling to room temperature, it was washed with deionized water to neutrality, and 128.45 g of a colorless liquid with the structure shown in the following formula was obtained by rotary evaporation, with a yield of 97.1%.

[0057]

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Abstract

The invention relates to a method for preparing organic silicon oligomer for encapsulating a large-power LED. The method comprises the following steps: performing degreasing condensation reaction on acetoxysilane, carboxylic acid and alkaneoxysilane in the presence of organic solvent and acid catalyst to prepare a condensation product; and washing, drying and removing solvent for the prepared condensation product to obtain the organic silicon oligomer. According to the method, the participation of water is avoided in the whole process, the reaction is easier to control, and gel or ring are not easy to form, so that the condensation and cyclization reactions of the alkaneoxysilane are reduced to the largest extent in the preparation process.

Description

technical field [0001] The invention relates to a preparation method of an organic silicon oligomer for high-power LED packaging, belonging to the field of chemistry. Background technique [0002] At present, the widely researched phenyl silicone resin encapsulation materials for high-power LEDs are mainly addition-type silicone resins, that is, in the presence of a platinum catalyst, the addition reaction of silicon vinyl and silicon hydrogen is carried out to carry out cross-linking and curing. Since the refractive index of the phenyl silicone resin used is generally high (>1.40), using a low refractive index silicone oligomer to cross-link it often results in poor compatibility of the system due to the difference in refractive index, and good transparency cannot be obtained. mixture. In addition, low-refractive silicone oligomers generally have a low boiling point, so they are easy to evaporate during heating and curing, resulting in loss of equivalent ratio. Therefo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C07F7/08
Inventor 陈维张学超陈田安
Owner YANTAI DEBANG ADVANCED SILICON MATERIALS
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