Water-based carrier for electronic slurry, electronic slurry containing the carrier and preparation method thereof
A technology of electronic slurry and water-based carrier, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., and can solve problems such as staff health hazards, electrode cracking and deformation, and increased production costs , to achieve the effect of not easy to crack and deform the electrode, reduce the surface tension and improve the wettability
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Embodiment 1
[0023] The invention is a water-based carrier for electronic slurry, the components and their weight percentages are: 93.5% of deionized water, 5% of water-based binder, 0.5% of dispersant, and 1% of plasticizer. Wherein, the water-based binder is a mixture of polyurethane and melamine resin in a weight ratio of 2:1; the dispersant is polyacrylic acid; and the plasticizer is dibutyl phthalate.
[0024] An electronic paste containing the above-mentioned water-based carrier, its composition and weight percentages are: 50% of conductive particles, 10% of glass powder, and 40% of water-based carrier. Among them, the conductive particles are silver powder with an average particle size of 1-5 μm; the glass powder is lead-free glass powder with an average particle size of no more than 5 μm; the components of the water-based carrier and their weight percentages are: deionized water 93.5 %, water-based binder 5%, dispersant 0.5%, plasticizer 1%, the water-based binder is a mixture of p...
Embodiment 2
[0029] A water-based carrier for electronic paste, the components and their weight percentages are: 70% deionized water, 15% water-based binder, 5% dispersant, and 10% plasticizer. Wherein, the water-based binder is acrylic resin; the dispersant is polyethylene glycol; the plasticizer is a mixture of glycerin and polypropylene alcohol in a weight ratio of 1:1.
[0030] An electronic paste containing the above-mentioned water-based carrier, its composition and weight percentages are: 79% of conductive particles, 1% of glass powder, and 20% of water-based carrier. Among them, the conductive particles are aluminum powder, and its average particle size is 1-5 μm; the glass powder is lead-free glass powder, and the average particle size of the glass powder is not more than 5 μm; the components and weight percentages of the water-based carrier are: deionized water 70%, water-based binder 15%, dispersant 5%, plasticizer 10%, water-based binder is acrylic resin, dispersant is polyethy...
Embodiment 3
[0035] A water-based carrier for electronic paste, the components and their weight percentages are: 80% deionized water, 10% water-based binder, 3% dispersant, and 7% plasticizer. Among them, the water-based binder is a mixture of unsaturated polyester, polyamide and amino resin in a weight ratio of 1:1:1; the dispersant is a mixture of polyacrylate and ammonium citrate in a weight ratio of 1:1; plasticizer for glycerin.
[0036] An electronic paste containing the above-mentioned water-based carrier, its composition and weight percentage are: 65% of conductive particles, 2% of glass powder, and 33% of water-based carrier. Among them, the conductive particles are a mixture of silver powder and aluminum powder in a weight ratio of 1:1, and the average particle size is 1-5 μm; the glass powder is lead-free glass powder, and the average particle size of the glass powder is not more than 5 μm; the composition of the water-based carrier Points and their weight percentages are: deio...
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