Two-dimensional code marking machine of lead frame and working method of two-dimensional code marking machine

Abstract

The invention discloses a two-dimensional code marking machine of a lead frame and a working method of the two-dimensional code marking machine. The marking machine comprises a lead frame conveyer, a direction detection device, a marking device and a lead frame blanking device; the lead frame conveyer comprises lead rails, a feeding conveying module, a middle material push and clamp module, a discharging pushing hand module and an oscillating blanking module; the feeding conveying module conveys the lead frame to be processed to the middle material push and clamp module; the middle material push and clamp module conveys the lead frame to be processed to a direction detection bit to detect the direction and mark; the discharging pushing hand module pushes the processed lead frame to the position of the oscillating blanking module, and the oscillating blanking module puts the qualified lead frame into a stack blanking box between the front lead rail and the rear lead rail. According to the two-dimensional code marking machine and the working method of the two-dimensional code marking machine disclosed by the invention, automatic conveying and automatic direction detection and marking of the lead frame to be processed can be achieved, and detection and location of the processed lead frame are achieved after automatically marking.

Description

technical field [0001] The invention relates to a marking machine for marking two-dimensional codes for lead frames in the integrated circuit (IC) industry and a working method suitable for marking two-dimensional codes. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire), and then forms an electrical circuit. The frame acts as a bridge to connect with the external wires. Most of the semiconductor integrated blocks need to use the lead frame, which is an important basic material in the electronic information industry. Previously, the manufacturing process of IC material strips and testing production process was to paste several chips on the lead frame, form IC material strips after welding and molding, and then test each chip on the...

AI Technical Summary

Problems solved by technology

But so far, most of the processes involved in the marking of two-dimensional codes and marking operations, such as loading, conveying and unloading, are done manually, which is not only inefficient, but also greatly affected by human factors.

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