Method for processing deep minipore with large gradient on difficult-to-process material

Abstract

The invention provides a method for processing a deep minipore with large gradient on a difficult-to-process material. The method comprises the following steps of: adding and fixing a cutting force balancing guide plate with reasonable thickness, excellent cutting performance and good locating cooperation and firm adhesion with a workpiece on the workpiece, milling an inclined plane vertical to the central axis of the hole on the guide plate through a large diameter milling tool, and converting deep inclined minipore processing into common minipore processing to solve the problems of large gradient of the difficult-to-process material, chip breaking, chip discharge, chip removal, cutter back-off, cutter vibration and cutter striking in the deep minipore cutting processing and the problem that the surface roughness and the length dimension of an entrance cannot meet the demand in direct processing, and the method provides reliable technical support for integral surface processing and anti-fatigue manufacturing and provides guarantee for improving the service life and safety of the parts.

Description

technical field [0001] The invention belongs to the field of machining, in particular to a method for machining large-slope deep and small holes on difficult-to-machine materials. Background technique [0002] Machining large-slope deep and small holes on high-temperature alloy structures has always been a difficult problem in the field of mechanical processing. The development process of the engine affects the overall quality of the engine. [0003] In the past, the deep and small inclined holes were all processed by electric discharge machining, but due to electrode discharge, force swing and other reasons, the aperture, angle, position and roughness could not meet the design requirements. There is a remelted layer in the hole, which is easy to induce fatigue cracks under thermal stress. It does not meet the surface integrity processing requirements, and does not meet the anti-fatigue manufacturing requirements of modern aero-engines, which seriously affects the life and ...

AI Technical Summary

Problems solved by technology

[0005] 1) When laser processing is used, like EDM, there is a problem that the remelted layer cannot be removed and the surface integrity is affected

[0006] 2) When direct cutting is used, due to the deep and small hole, the diameter-to-length ratio of the machining tool is large and the strength is low. Serious knife and knife vibration, rough cutting surface, entrance size cannot meet drawing requirements

[0008] (1) Due to the lengthened chip removal channel of the drill sleeve, the chip removal and chip removal are not smooth, and the cutting heat is difficult to dissipate, making the tool easily broken and worn during work;

[0009] (2) Because the drill sleeve increases the depth of the hole, the length of the tool increases, the aspect ratio increases, the strength decreases, the rigidity deteriorates, and the tool vibrates and the tool is intensified during processing;

[0010] (3) The tool is lengthened, the manufacturing difficulty is increased, the cost is increased, and the economy is reduced

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