Heat dissipation structure for electronic device
A technology of heat dissipation structure and electronic equipment, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve problems such as electronic component failures, malfunctions, and equipment changes, and achieve the effect of improving heat dissipation
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[0076] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same reference numerals are used for the same constituent members, and detailed descriptions are appropriately omitted.
[0077] The heat dissipation structure of the electronic device of this embodiment relates to an electronic device provided with a substrate on which electronic components such as an IC chip (semiconductor chip) are mounted, for example, Figure 1A As shown, the heat sink 1 (1A, 1B) is interposed between the IC chip 3 (3A, 3B) mounted on the substrate 2 and a cover member 4 such as a substrate cover covering the mounting surface side of the substrate 2 to dissipate heat.
[0078] In addition, as the heat sink, it is preferable to have flexibility that is easily deformable in the thickness direction and is easily crimped and reliably abuts against the IC chip 3 despite the deviation in the size of the gap between the IC chip 3 and the cover me...
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