Printed circuit board, method and device for drilling printed circuit board

Abstract

The invention relates to a printed circuit board, a method and a device for drilling the printed circuit board. The method includes that a first drill bit of a drill starts drilling from the initial position, and when contacting with a conductive layer on the surface layer of a testing coupon area of the printed circuit board, the drill acquires a first electric signal so as to determine a first conductive position and the first height difference between the initial position and the first conductive position; the first drill bit of the drill drills the conductive layer of the surface layer, a second drill bit can drill continuously; when contacting with the other conductive layer of the testing coupon area of the printed circuit board, the drill acquires a second electric signal so as to determine a second conductive position and a second height difference between the initial position and the second conductive position; the third height difference is obtained by computing the difference between the second height difference and the first height difference; and the position requiring back drilling is subjected to back drilling according to the third height difference. Accurate depth information is acquired by testing blind holes, and Stub length of back drilling is reduced.

Description

technical field [0001] The present invention relates to the technical field of manufacturing printed circuit boards (Printed Circuit Board, PCB), in particular to a printed circuit board, a drilling method and device for the printed circuit board. Background technique [0002] With the rapid development of wireless and network communication technologies, the operating frequency of communication products is getting higher and higher, and the increase in operating frequency of communication products puts forward higher requirements for loss control in the transmission process. The back-drilling of the printed circuit board is a processing method that effectively reduces the loss of the hole link. The smaller the length of the redundant hole copper (Stub) above the signal layer after the back-drilling, the smaller the loss. [0003] Under the existing technology, the plated through hole (Plated Through Hole, PTH) is generally back-drilled according to the pre-calculated theoret...

AI Technical Summary

Problems solved by technology

Due to the uneven thickness of the PCB board, there are certain differences in the thickness of the same batch of PCB boards, even the thickness of different positions of the same PCB board is also different

The disadvantage of the existing technology is that the back-drilling depth obtained according to the test results of the conventional back-drilling Coupon position on the edge of the PCB deviates from the actual depth of the back-drilling position on the PCB, and the thicker the PCB, the greater the absolute value of the deviation , the greater the deviation of the back drilling depth

[0004] The functions realized by the PCB are becoming more and more complex, and the degree of integration is getting higher and higher. Correspondingly, the PCB board needs more layers and greater thickness to meet the functional design requirements of the PCB board. The deviation of the back drilling depth obtained from the test results at the Coupon position is large, which makes the length of the stub large, and the loss of the hole link has a great impact on high-frequency signal transmission.

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