Chemical mechanical polishing (CMP) grinding pad finishing structure

A technology for grinding pads and dressing surfaces, which is applied to parts of grinding machine tools, grinding/polishing equipment, and abrasive surface adjustment devices, etc., can solve problems such as shortening the service life of grinding pads, and achieve the effect of simple structure and convenient production.

Active Publication Date: 2013-01-09
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

thus shortening the service life of the abrasive pad

Method used

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  • Chemical mechanical polishing (CMP) grinding pad finishing structure
  • Chemical mechanical polishing (CMP) grinding pad finishing structure
  • Chemical mechanical polishing (CMP) grinding pad finishing structure

Examples

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Embodiment Construction

[0020] The present invention will be explained in detail below in conjunction with the accompanying drawings.

[0021] like figure 2 A CMP polishing pad dressing structure of an embodiment of the present invention shown in , includes a polishing pad 1 and a dresser 2 . The dresser 2 includes a dressing surface 21 placed above the upper surface 11 of the polishing pad 1 . The upper surface of the polishing pad 1 can be dressed by the dressing surface 21 .

[0022] like figure 2 As shown in , the upper surface 11 of the polishing pad 1 is circular in shape, and several circular grooves 12 are provided on the upper surface 11 of the polishing pad 1 .

[0023] like image 3 As shown in , the trimming surface 21 of the trimmer 2 is provided with several strip-shaped abrasive belts 22 . and combine figure 1 and figure 2 , the width of the strip-shaped grinding belt 22 is less than or equal to the width of the circular groove 12 on the upper surface 11 of the grinding pad 1...

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PUM

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Abstract

The invention provides a chemical mechanical polishing (CMP) grinding pad finishing structure, which comprises a finishing device and a grinding pad, wherein the finishing device comprises a finishing surface, the finishing surface is arranged above the upper surface of the finishing pad, the upper surface of the grinding pad is of a circular shape, the upper surface of the grinding pad is provided with a plurality of circular grooves, the finishing surface of the finishing device is provided with a plurality of strip-shaped grinding bands, the width of each strip-shaped grinding band is smaller than or equal to the width of each circular groove on the upper surface of the grinding pad, and the interval among the strip-shaped grinding bands is equal to that among the circular grooves on the upper surface of the grinding pad. The CMP grinding pad finishing structure has advantages of simpleness in structure and convenience in production. The grinding pad finishing efficiency can be well improved, and the service life of the grinding pad can be prolonged.

Description

technical field [0001] The invention relates to the field of semiconductor machinery manufacturing, and relates to a grinding structure, in particular to a CMP grinding pad trimming structure. Background technique [0002] Chemical Mechanical Polishing (CMP) is a process in which a chemical reaction process and a mechanical polishing process work together. During the grinding process, the grinding head exerts a certain pressure on the back of the wafer to make the front of the wafer close to the grinding pad. At the same time, the grinding head drives the wafer and the grinding pad to rotate in the same direction, causing mechanical friction between the front of the wafer and the grinding pad. During the grinding process, a series of complex mechanical and chemical actions are used to remove a layer of film on the surface of the wafer, so as to achieve the purpose of wafer flattening. [0003] In order to increase the friction between the wafer and the polishing pad and im...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B53/017
Inventor 邓镭
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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