Preparation method of high-low frequency hybrid-voltage printed circuit board

A printed circuit board, high and low frequency technology, applied in the field of high and low frequency mixed pressure printed circuit board preparation, to achieve the effect of reducing material consumption, reducing destructive testing and improving alignment

Inactive Publication Date: 2014-08-06
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a method for preparing a high-low frequency mixed-pressure printed circuit board. The method is to embed a high-frequency embedding plate on the top layer of the low-frequency main substrate, and embed a metal heat dissipation plate on the bottom layer of the low-frequency main substrate through process edge riveting and positioning. It solves the problem of the alignment between the main substrate and the high-frequency embedded board, reduces the destructive inspection after the low-frequency main substrate and the high-frequency embedded board are laminated, and the obtained multi-layer board meets the requirements of high-frequency circuit design and local high heat dissipation

Method used

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  • Preparation method of high-low frequency hybrid-voltage printed circuit board
  • Preparation method of high-low frequency hybrid-voltage printed circuit board
  • Preparation method of high-low frequency hybrid-voltage printed circuit board

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Embodiment Construction

[0022] It is the same as the foregoing technical solutions, and will not be repeated here. However, all other implementations obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

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Abstract

The invention discloses a method for preparing a high-low frequency mixed voltage printed circuit board, which belongs to the technical field of printed circuit board manufacturing. In the present invention, a process side 2023 and an alignment side 2033 are respectively added to the low-frequency main substrate 202 and the high-frequency embedded board 203, and the added alignment sides have riveting alignment holes, alignment detection holes and alignment The test rectangular window greatly improves the alignment between the low-frequency main substrate and the high-frequency embedded board, reduces the destructive inspection after the low-frequency main substrate and the high-frequency embedded board are pressed together, and can reduce the material consumption of the high-frequency embedded board.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board manufacturing, and relates to a high-low frequency mixed voltage printed circuit board, especially a preparation method of a high and low frequency mixed voltage printed circuit board with good heat dissipation performance. Background technique [0002] The development trend of miniaturization, high density and multi-function of electronic information products requires improving the signal transmission speed (frequency) and heat dissipation performance of printed circuit board (Printed Circuit Board, PCB). The materials used in traditional high-frequency PCB manufacturing are relatively expensive, which is not conducive to the popularization of high-frequency signal designs with high electrical performance in civilian electronic information products. The outer layer of the multi-layer circuit board is mixed with high-frequency board or a small piece of high-frequency board is embedde...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 何为李瑛陈苑明王守绪陶志华
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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