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White-light LED (Light Emitting Diode) and packaging method thereof

A packaging method and white light technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of not enough soft color, poor color rendering, weak red spectrum of white LEDs, etc. The effect of color rendering

Active Publication Date: 2012-11-28
内蒙古华延芯光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the second method is to coat YAG phosphor (Ce rare earth phosphor) on the blue light chip. Since it is difficult to effectively control the color temperature with a single YAG phosphor, the red spectrum of the packaged white LED is weak and the color is not soft enough. The color rendering is not good, and the color rendering index is usually between 50 and 80, which is difficult to meet the market's requirements for high color rendering lighting; and the single lamp area of ​​the existing white light LEDs is greater than 25 square millimeters, it is difficult to meet people's expectations for white light. Requirements for light sources to be short, light and thin

Method used

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  • White-light LED (Light Emitting Diode) and packaging method thereof
  • White-light LED (Light Emitting Diode) and packaging method thereof
  • White-light LED (Light Emitting Diode) and packaging method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0029] like figure 1 , figure 2 , image 3 , Figure 4 and Figure 5 Commonly shown, a white light LED, this white light LED is a SMD3014 lamp bead, including a bracket 1, a bracket electrode 10 is provided at the lower part of the bracket, a cooling cup 6 is fixed on the bracket electrode 10, and the bracket electrode 10 is the bottom of the cooling cup 6 A blue light chip 2 is provided on the bracket electrode 10 located at the bottom of the heat dissipation cup 6, and a wire 3 is connected between the blue light chip 2 and the bracket electrode 10, and the wire 3 is a gold wire; the inside of the heat dissipation cup 6 is coated with fluorescent glue 4, Fluorescent glue 4 is prepared from the following raw materials, nitride red phosphor R6733 (Intemet Optoelectronics (Shenzhen) Co., Ltd.): positive white phosphor Y4651 (Intemet Optoelectronics (Shenzhen) Co., Ltd.): green phosphor G3560 (Intemei Optoelectronics (Shenzhen) Co., Ltd.): Silicone 6551AB (Dow Corning 6551 ...

Embodiment 2

[0041] like figure 1 , figure 2 , image 3 , Figure 4 and Figure 5Commonly shown, a white light LED, its structure is basically the same as that of Example 1, the difference lies in the weight ratio of nitride red phosphor R6733, positive white phosphor Y4651, green phosphor G3560 and silica gel 6551AB in fluorescent glue 4 For: nitride red phosphor R6733: positive white phosphor Y4651: green phosphor G3560: silica gel 6551AB=X:Y:Z:1000, where X=4, Y=93, Z=3.

Embodiment 3

[0043] like figure 1 , figure 2 , image 3 , Figure 4 and Figure 5 Commonly shown, a white light LED, its structure is basically the same as that of Example 1, the difference lies in the weight ratio of nitride red phosphor R6733, positive white phosphor Y4651, green phosphor G3560 and silica gel 6551AB in fluorescent glue 4 For: nitride red phosphor R6733: positive white phosphor Y4651: green phosphor G 3560: silica gel 6551AB=X:Y:Z:1000, where X=7, Y=87, Z=6.

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Abstract

The invention provides a white-light LED (Light Emitting Diode) and a packaging method thereof, and relates to the technical field of semiconductor packaging. The white-light LED comprises a bracket, wherein a bracket electrode is arranged at the lower part of the bracket; a heat radiation cup is fixed on the bracket electrode; a blue-light chip is arranged on the bracket electrode positioned at the bottom of the heat radiation cup; a conductor is connected between the blue-light chip and the bracket electrode; a fluorescent adhesive is coated in the heat radiation cup; the fluorescent adhesive is prepared by the raw materials of nitride red fluorescent powder R6733, true white fluorescent powder Y4651, green fluorescent powder G3560 and silica gel 6551AB according to the ratio of X:Y:Z:1000, wherein X is 3-10, Y is 80-95 and Z is 2-10. The white-light LED and the packaging method thereof, provided by the invention, have the advantages as follows: the color rendering property of the white-light LED is improved and the color rendering index of the white-light LED can reach 95, so that emitted white lights are more comfortable and softer and much closer to sun lights; and the white-light LED has a small area, so that requirements of people on the short, light and thin white-light source can be satisfied.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a white light LED and a packaging method thereof. Background technique [0002] LED (Light Emitting Diode) is a semiconductor that can convert electrical energy into light energy. It changes the principle of tungsten filament luminescence of incandescent lamps and three-based toner luminescence of energy-saving lamps, and uses electric field luminescence. The spectrum of white light LEDs is almost all concentrated in the visible light frequency band. Comparing white light LEDs with ordinary incandescent lamps, spiral energy-saving lamps and tricolor fluorescent lamps, the characteristics of LEDs are very obvious: long life, high luminous efficiency, low radiation and low power consumption. It is precisely because of these advantages of LED that white LED lighting has entered a period of rapid development. White light LEDs are usually formed by two methods: one is...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/02H01L33/48
Inventor 吉爱华汪英杰王凯敏
Owner 内蒙古华延芯光科技有限公司
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