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Addition-curable silicone composition and optical semiconductor device using the same

An addition-curing, silicone technology, used in semiconductor devices, electrical components, circuits, etc., can solve the problems of addition-curing silicone sealing materials, such as curing obstruction and inability to use, and achieves excellent ejectability and light emission. The effect of excellent reflectivity and excellent shape stability

Active Publication Date: 2017-03-01
SHIN ETSU CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a long curing time from half a day to several days and a curing agent for crosslinking it cannot be used because of curing hindrance to the crosslinking of the addition curing type silicone sealing material

Method used

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  • Addition-curable silicone composition and optical semiconductor device using the same
  • Addition-curable silicone composition and optical semiconductor device using the same
  • Addition-curable silicone composition and optical semiconductor device using the same

Examples

Experimental program
Comparison scheme
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Embodiment 1～3、 comparative example 1～4

[0088] According to the compounding quantity shown in Table 1, the components shown below were uniformly mixed with the universal mixing mixer (Shinagawa mixer) manufactured by Daluton Co., Ltd., and the silicone composition was prepared.

[0089] [A] An organopolysiloxane having two vinyl groups directly bonded to a silicon atom in one molecule and a viscosity of 10,000 mPa·s (25°C with vinyl groups directly bonded to a silicon atom at both ends of the molecule) 80 parts by mass of organopolysiloxane with a viscosity of 5,000 mPa·s and prepared by Me 3 SiO 1 / 2 、ViMe 2 SiO 1 / 2 (Me represents a methyl group, Vi represents a vinyl group. The same applies below.) and SiO 4 / 2 Cell composition, relative to SiO 4 / 2 , Me 3 SiO 1 / 2 and ViMe 2 SiO 1 / 2 The molar ratio is 0.8, and the amount of vinyl groups relative to the solid content is 0.085 mol / 100g of a mixture of 20 parts by mass of silicone resin)

[0090] [B-1] has a trimethoxysilylethyl group directly bonded to a silic...

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Abstract

The invention provides an addition solidifying type organosilicone composition having proper viscosity (ejecting property), nonliquidity (shape stability when being heated for solidification), and excellent optical reflection, and a photosemiconductor apparatus using the same. The addition solidifying organosilicone composition is particularly applicable to the reflecting material of the LED with self-adhesiveness. The self-adhesiveness addition solidifying type organosilicone composition applicable to photosemiconductor apparatus comprises the following procedures: (A) one molecule comprises at least two organopolysiloxanes of alkenyl bonded with the silicon atom, 100 parts by mass; (B) one molecule comprises at least two hydrogen atoms bonded with silicon atoms and at least one organic polysiloxane of the alkoxy, with the general Si-H-yl number being 1.4-5.0 times of the general alkene-yl number of the component (A); (C) fumed silica, relative to 100 parts by mass of the components (A) and (B), has 8 to 30 parts by mass; (D) white pigment; and (E) solidifying catalyst.

Description

technical field [0001] The present invention relates to a non-fluidity (shape stability at the time of heat curing) and excellent light reflectivity, which has an appropriate viscosity (discharging property), and is particularly related to a self-adhesive additive used in light reflective materials for LEDs. A curable silicone composition and an optical semiconductor device using it. Background technique [0002] In recent years, attempts have been made to use LEDs for notebook computers, LCD TVs, and the like. In order to uniformly illuminate the large screen, it is realized by arranging many side-view LEDs or top-view LEDs. In contrast, there is also a method of forming a sealing material in a dome shape on a circuit board in which LED chips and wiring are connected to a substrate called a map board. This sealing material can be formed by dropping a few drops of liquid silicone and heating and curing. However, there is a problem that effective sealing cannot be achieved ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/06C08K3/36H01L33/56
Inventor 山川直树小材利之木村真司
Owner SHIN ETSU CHEM CO LTD
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