In Gan/Si dual-junction solar cell
A solar cell, p-inxga1-xn technology, applied in the field of solar cells, can solve the problems of reducing the total conversion efficiency of the cell, increasing the complexity of the epitaxy process, increasing the production cost, etc., so as to improve the total conversion efficiency, improve the radiation resistance, The effect of prolonging the service life
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[0024] Embodiment: refer to attached Figure 1-Figure 2 , the fabrication process of the InGaN / Si double-junction solar cell of the present invention is described:
[0025] Step 1, select n-Si after ultrasonic cleaning as the substrate;
[0026] Step 2. Using Metal Organic Chemical Vapor Deposition (MOCVD), place the n-Si substrate 1 in the reaction chamber, and feed TMAl with a flow rate of 30mL / min and NH 3 The flow rate is 3L / min, and at 600°C, Al atoms begin to diffuse into the n-Si layer to replace Si atoms, forming a highly doped surface, and then the temperature rises to 1000°C, Al atoms diffuse further, forming a deep junction with the n-Si substrate 0.1um p-Si layer 2, on which a 60nm-thick AlN nucleation layer 3 grows; the p-Si layer and n-Si layer constitute a Si bottom battery, which is not only easy to prepare, but also a battery The total conversion efficiency can reach more than 30%;
[0027] Step 3, using metal-organic chemical vapor deposition technology to...
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