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Method for processing metal film strainometer based on MEMS (Micro-electromechanical Systems)

A metal film, strain gauge technology, applied in metal material coating process, process for producing decorative surface effects, electric/magnetic solid deformation measurement, etc. Strain measurement and low power consumption measurement, to achieve the effect of miniaturization, realization of point stress and torque, and improved sensitivity

Inactive Publication Date: 2012-10-17
NORTHWESTERN POLYTECHNICAL UNIV
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] Due to the low sensitivity and high power consumption of traditional strain gauges, it is difficult to meet the requirements of micro strain measurement and low power consumption measurement

Method used

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  • Method for processing metal film strainometer based on MEMS (Micro-electromechanical Systems)
  • Method for processing metal film strainometer based on MEMS (Micro-electromechanical Systems)
  • Method for processing metal film strainometer based on MEMS (Micro-electromechanical Systems)

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Embodiment Construction

[0026] Specific implementation examples

[0027] The metal film strain gauge based on MEMS to be prepared in this embodiment is as Image 6 As shown, it includes a bow-shaped strain gauge sensitive grid and anchor points at both ends of the sensitive grid; the material of the strain gauge sensitive grid is Ni–Cr alloy, and the material of the strain gauge anchor point is AL.

[0028] Corresponding respectively figure 1 (a)-(k), the processing method of the metal film strain gauge based on MEMS in the present embodiment, comprises the steps:

[0029] Step 1, cleaning the silicon wafer 1, removing the native oxide layer and organic contamination on the surface, and then drying. The thickness of ordinary silicon wafer is 200μm, such as figure 1 (a);

[0030] Step 2, use the silicon wafer 1 as the substrate to spin-coat PDMS, cure at 65°C for 1 hour, and use it as the adhesive layer 2, such as figure 1 (b);

[0031] The PDMS is mixed with the PDMS prepolymer and the curing a...

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Abstract

The invention discloses a method for processing a metal film strainometer based on an MEMS (Micro-electromechanical Systems). According to the method, repeated polyimide spinning and processing are adopted so that a substrate and a covering layer of the strainometer are respectively formed, a sensitive grid part and an anchoring point of the strainometer are respectively formed by adopting metal stripping, wet-method corrosion and the like, and self release of the strainometer is realized by using alcohol soaking. Compared to the prior art, in the method, the sensitive grid layer material of the strainometer is directly sputtered on the substrate of the strainometer by adopting a magnetron sputtering process without using adhesives so that the performance of the strainometer is improved; by adopting the new process, the problem of lower flatness caused by air bubbles generated by manually sticking a polyimide film can be solved, thus saving time and labor; by adopting an MEMS processing process, the sensitivity, the resolution ratio and the measuring range of the strainometer are improved, and the power consumption of the strainometer is reduced; the method realizes tiny strain measurement and point strain and torsion measurement, reduces influences on tested pieces in the measuring process and improves the measurement precision; and the method is easy to realize mass production and reduces the cost of individual device.

Description

technical field [0001] The invention relates to a method in the technical field of micro-electromechanical systems, in particular to a MEMS processing method for a metal film strain gauge. Background technique [0002] Strain is the relative change in shape and size of any point or unit body in objects such as mechanical parts and components caused by external forces. The resistance strain gauge is a sensitive element that converts the strain of the tested piece into a change in resistance. It is a key element for measuring stress, strain and structural strength tests in experimental stress analysis. It is also used to manufacture sensors that can measure various physical quantities. Sensitive components are widely used. [0003] Due to the low sensitivity and high power consumption of traditional strain gauges, it is difficult to meet the requirements of micro strain measurement and low power consumption measurement. MEMS processing methods expand the application range of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00G01B7/16
Inventor 谢建兵周平伟杨勇郭勇君洪水金袁广民
Owner NORTHWESTERN POLYTECHNICAL UNIV
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