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Method for generating laser beam irradiation trajectory

A laser beam and trajectory technology, applied in laser welding equipment, electrical components, circuits, etc., can solve problems such as low productivity and time-consuming, and achieve the effect of improving productivity and processing efficiency

Active Publication Date: 2012-10-17
HANMI SEMICON CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, as mentioned above, in the related art, since the spiral trajectory of the laser beam is firstly generated by CAD, and the digital information of the trajectory is provided to a controller of the laser beam irradiation device, any time only If the type of the semiconductor package to be manufactured changes, it is necessary to repeat the generation of the spiral trajectory
[0009] Therefore, since the spiral trajectory generation takes a lot of time, the productivity is low

Method used

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  • Method for generating laser beam irradiation trajectory
  • Method for generating laser beam irradiation trajectory
  • Method for generating laser beam irradiation trajectory

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Embodiment Construction

[0032] Reference will now be made in detail to these specific embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers refer to the same or similar parts throughout these drawings.

[0033] For reference only, although the following description relates to a method according to the present invention of generating a laser beam radiation trace for forming a via hole in a package-on-package (PoP; Package on Package) type semiconductor package manufacturing process, the The through hole makes a solder ball pad exposed from the mold part of the semiconductor package—a specific embodiment, but the present invention is not limited thereto, but can be applied to all semiconductor package manufacturing processes in the same or similar manner, that is, in each In these semiconductor package manufacturing processes, laser beams are irradiated along a spiral trajectory to form a predetermined pattern.

[00...

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Abstract

The present invention relates to a method for generating a laser beam irradiation trajectory for processing a semiconductor package, capable of automatically, accurately and easily generating a laser beam irradiation trajectory in a mold portion of the semiconductor package during manufacture of the semiconductor package. According to the present invention, the method for generating a laser beam irradiation trajectory for a semiconductor package-processing apparatus, which irradiates a laser beam onto the mold portion of the semiconductor package along a spiral trajectory to form via holes, comprises the steps of: enabling a controller of a laser beam irradiation apparatus, in which a plurality of spiral trajectory patterns are stored by types, to select one of the spiral trajectory pattern types; inputting information on the selected spiral trajectory pattern to generate a spiral trajectory; and inputting a laser beam irradiation condition.

Description

[0001] This application is a divisional application of the original application with the filing date of February 5, 2010, the application number 201080005123.4 (the international application number is PCT / KR2010 / 000707), and the invention title is "Method for Generating Laser Beam Radiation Trajectories" . technical field [0002] The present invention relates to a method for generating a laser beam radiation trajectory for processing a semiconductor package, and more particularly, to a method for generating a laser beam radiation trajectory for manufacturing a semiconductor package, by which method, in a package-on-package (PoP; Package on Package ), etc., can automatically, accurately and easily generate a helical laser beam radiation track directed at a mold part of the semiconductor package during the manufacturing process of a semiconductor package. Background technique [0003] Currently, according to the development trend of small size and multi-purpose with various f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38H01L21/56H01L23/31
CPCH01L23/3128B23K26/386H01L21/56B23K26/389H01L2924/0002H01L2924/00H01L21/00H01L23/00
Inventor 许一崔弘赞金渶桓
Owner HANMI SEMICON CO LTD
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