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Method for generating laser beam radiation trajectories

A laser beam and trajectory technology, applied in laser welding equipment, electrical components, circuits, etc., can solve the problems of low productivity and time-consuming, and achieve the effect of improving productivity and processing efficiency

Inactive Publication Date: 2011-12-21
HANMI SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, as mentioned above, in the related art, since the spiral trajectory of the laser beam is firstly generated by CAD, and the digital information of the trajectory is provided to a controller of the laser beam irradiation device, any time only If the type of the semiconductor package to be manufactured changes, it is necessary to repeat the generation of the spiral trajectory
[0008] Therefore, since the spiral trajectory generation takes a lot of time, the productivity is low

Method used

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  • Method for generating laser beam radiation trajectories
  • Method for generating laser beam radiation trajectories
  • Method for generating laser beam radiation trajectories

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Embodiment Construction

[0031] Reference will now be made in detail to these specific embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers refer to the same or similar parts throughout these drawings.

[0032] For reference only, although the following description relates to a method according to the present invention of generating a laser beam radiation trace for forming a via hole in a package-on-package (PoP; Package on Package) type semiconductor package manufacturing process, the The through hole makes a solder ball pad exposed from the mold part of the semiconductor package—a specific embodiment, but the present invention is not limited thereto, but can be applied to all semiconductor package manufacturing processes in the same or similar manner, that is, in each In these semiconductor package manufacturing processes, laser beams are irradiated along a spiral trajectory to form a predetermined pattern.

[00...

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Abstract

The invention relates to a method for generating laser beam radiation tracks in the semiconductor packaging manufacturing process, which can automatically, accurately and easily generate laser beam radiation tracks in the mold part of the semiconductor package during semiconductor package manufacturing. According to the present invention, the method is used in a semiconductor package processing device to generate a laser beam radiation track, the device radiates a laser beam on a molded part of a semiconductor package by a plurality of holes along a helical track, comprising the following steps: enabling a A controller of a laser beam irradiating device, wherein a plurality of spiral trajectory patterns are stored by type, to select one of the spiral trajectory pattern types; input information of the selected spiral trajectory pattern to generate a spiral trajectory; and input a laser beam radiation conditions.

Description

technical field [0001] The present invention relates to a method for generating a laser beam radiation trajectory for processing a semiconductor package, and more particularly, to a method for generating a laser beam radiation trajectory for manufacturing a semiconductor package, by which method, in a package on package (PoP; Package on Package) ) etc. in the manufacturing process of a semiconductor package can automatically, accurately and easily generate a helical laser beam radiation track pointing to a mold part of the semiconductor package. Background technique [0002] At present, according to the development trend of small size and multi-purpose with various functions, such as mobile portable phones, portable Internet devices and portable multimedia terminals, such as multi-chip packaging (MCP; Multi Chip Package) and stacked Various semiconductor packaging technologies of package on package (PoP; Package on Package) technologies are under development, and these techn...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L23/00
CPCH01L23/3128H01L21/56B23K26/386B23K26/389H01L2924/0002H01L2924/00H01L21/00H01L23/00
Inventor 许一崔弘赞金渶桓
Owner HANMI SEMICON CO LTD
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