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Device for eliminating optical interference effect in wave plate processing process

A process and optical interference technology, applied in the direction of using optical devices, measuring devices, instruments, etc., can solve the problems of inaccurate grinding thickness of wave plates, and achieve the effect of eliminating interference effects, strong feasibility and low cost.

Inactive Publication Date: 2012-10-03
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the measurement light propagates in the wave plate and the optical plastic disc, it is transmitted and reflected at the same time on the upper surface of the wave plate and the lower surface of the optical plastic disc. Due to the interference of light between the reflected light and the light transmitted through the wave plate, this interference The existence of the effect directly affects the measurement results of the phase delay of the wave plate, resulting in inaccurate grinding thickness of the wave plate

Method used

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  • Device for eliminating optical interference effect in wave plate processing process
  • Device for eliminating optical interference effect in wave plate processing process
  • Device for eliminating optical interference effect in wave plate processing process

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Embodiment Construction

[0015] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0016] Such as figure 1 As shown, the device for eliminating the optical interference effect of the present invention comprises a photoresist disc 1, more than one wave plate 2 to be ground and a flat glass 3; , the plate glass 3 is arranged on the upper surface of the wave plate 2, and the upper surface of each wave plate 2 and the lower surface of the plate glass 3 are in contact with a matching layer 4 made of a refractive index matching liquid. The function of the matching layer 4 is to make each The wave plate 2 is in close contact with the flat glass 3 without air, and an antireflection film 5 is provided on the upper surface of the flat glass 3 and the lower surface of the photoresist disc 1 respectively.

[0017] In the above-mentioned embodiment, the refractive index of the photoresist disc 1 is usually 1.5-1.53, which can be made of BK7 gla...

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Abstract

The invention relates to a device for eliminating the optical interference effect in a wave plate processing process. The device is characterized by comprising an optical cement plate, wherein more than one wave plate to be processed is arranged on the optical cement of the optical cement plate; flat glass is arranged on the wave plate; the contact position of each wave plate and the flat glass is provided with a matching layer which is made from index matching fluid; and an antireflection film is respectively arranged on the upper surface of the flat glass and the lower surface of the optical cement plate. The device for eliminating the optical interference effect in the wave plate processing process can be widely applied to the wave plate processing detection process.

Description

technical field [0001] The invention relates to an auxiliary device for ensuring the processing accuracy of optical elements, in particular to a device for eliminating optical interference effects during wave plate processing. Background technique [0002] Waveplates are basic optical components and are widely used in polarization-related optical systems. The processing accuracy of waveplates directly affects the performance of these optical systems. In order to ensure the processing accuracy of the wave plate, the wave plate photoresist is usually ground and polished on the optical plastic disc. During the wave plate grinding and polishing process, the measuring beam is firstly irradiated vertically on the wave plate, and the light propagates through the wave plate to the optical plastic disc. , the detection device receives the light transmitted from the optical plastic disk and detects the phase delay of the wave plate to determine the grinding thickness of the wave plate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/06
Inventor 张书练陈文学
Owner TSINGHUA UNIV
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