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High-heat conducting high-air permeability less-glue mica tape and preparing method thereof

A technology of less rubber mica tape and high thermal conductivity, which is applied in the direction of electrical components, insulators, insulators, etc., can solve the problems affecting the high air permeability of mica tape, achieve good adhesion, improve thermal conductivity, and good softness.

Active Publication Date: 2012-09-26
SUZHOU JUFENG ELECTRICAL INSULATION SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But whether it is possible to endow the mica tape with other excellent properties such as high thermal conductivity without affecting the high air permeability of the mica tape based on this method is unpredictable

Method used

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  • High-heat conducting high-air permeability less-glue mica tape and preparing method thereof
  • High-heat conducting high-air permeability less-glue mica tape and preparing method thereof
  • High-heat conducting high-air permeability less-glue mica tape and preparing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] This embodiment provides a mica tape with high thermal conductivity, high air permeability and less glue. Such as figure 1 and 2 As shown, the high thermal conductivity and high air permeability mica tape with less glue includes a mica paper layer A, a reinforcing material layer C, and a resin adhesive layer B between the mica paper layer A and the reinforcing material layer C. The resin adhesive layer B includes the resin adhesive 4 evenly distributed on the interface of the mica paper layer A and the reinforcing material layer C in dots. The mica paper layer A is composed of mica paper, wherein the mica paper is made by adding high thermal conductivity inorganic particles and / or high thermal conductivity inorganic fibers 1 with a weight fraction of 2% to 30% into the non-calcined muscovite flakes 2, and making pulp, The thickness of mica paper is 0.1-0.2mm, and the mass per unit area is 80-220g / m 2 . The reinforcing material layer C is composed of a fiber cloth 6 ...

Embodiment 2

[0057] This embodiment provides a kind of mica tape with high thermal conductivity and high air permeability and less glue, its structure is the same as that of embodiment 1, and according to image 3 The procedure shown was prepared. Concrete preparation steps are as follows:

[0058] (1), preparation of high thermal conductivity resin powder: epoxy powder resin with epoxy equivalent of 1490g / equivalent and boron nitride inorganic particles with a mass fraction of 52% and a particle size of 20-80 μm and a mass fraction of 20%, After the silicon nitride micropowder with a particle size of 200nm~5μm is mixed evenly, it is extruded and granulated by a twin-screw extruder, crushed at minus 40°C and sieved to obtain a thermal conductivity of 1.15W / m*K, and a particle size of 90-120 mesh, high thermal conductivity resin powder with a melting temperature of 145°C.

[0059] (2) Mica paper unwinding, wherein: mica paper is non-calcined muscovite paper, and its air permeability is 18...

Embodiment 3

[0065] The present embodiment provides a kind of preparation method of high thermal conductivity and high air permeability less rubber mica tape, which according to image 3 The process shown is carried out, specifically including the following steps:

[0066] (1), preparation of high thermal conductivity resin powder: epoxy powder resin with epoxy equivalent of 2150g / equivalent and boron nitride inorganic particles with a mass fraction of 51% and a particle size of 20-80 μm and a mass fraction of 23%, After the silicon nitride micropowder with a particle size of 500nm~5μm is mixed evenly, it is extruded and granulated by a twin-screw extruder, crushed at minus 40°C and sieved to obtain a thermal conductivity of 1.08W / m*K, and a particle size of 100-150 mesh, high thermal conductivity resin powder with a melting temperature of 147°C.

[0067] (2) Mica paper unwinding, wherein: mica paper is non-calcined muscovite paper, and its air permeability is 185s / 100cm 3 , the thermal ...

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Abstract

The invention relates to a high-heat conducting high-air permeability less-glue mica tape and a preparing method thereof. The less-glue mica tape includes a mica paper layer, a reinforcing material layer, a resin adhesives layer and a heat conducting short staple, wherein a large amount of pore channels exist in the mica paper layer, the reinforcing material layer and the resin adhesive layer; the resin adhesive layer includes the resin adhesive uniformly distributed on the mica paper layer and the reinforcing material layer in points; the resin adhesive is formed by high-heat conducting resin powder with the heat conductivity of 0.7 to 1.2W / m*K, the particle size is 60 to 200 mesh, and the melting temperature of 100 to 180 degrees; the diameter of the heat conducting short staple is 0.1 to 100 micrometers, the length thereof if 5 micrometers to 10mm, and the heat conductivity is 2 to 200 W / m*K. The less-glue mica tape has high heat conducting performance and high air permeability, ishighly flexible, and has long working life and economic and environment-friendly preparing method.

Description

technical field [0001] The invention relates to a mica tape with high thermal conductivity and high air permeability and less glue and a preparation method thereof. Background technique [0002] With the continuous improvement of motor voltage level and capacity, the requirements for motor insulation are also continuously improved. At present, there are mainly two insulation treatment processes for large high-voltage motors, vacuum pressure impregnation (VPI) with less glue and molding with more glue. In the 1970s, multinational corporations such as Westinghouse Electric proposed the theory of less glue in motor insulation, and began to use the new VPI insulation process with less glue mica tape as the main insulation material to produce high-voltage motors. Due to the increased mica content of the VPI main insulation with less glue, on the one hand, it can greatly reduce the insulation thickness and improve the motor’s voltage level, corona resistance and other aspects of ...

Claims

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Application Information

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IPC IPC(8): H01B17/60H01B17/66H01B19/00
Inventor 徐伟红王文夏宇王见知
Owner SUZHOU JUFENG ELECTRICAL INSULATION SYST
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