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Back plate and backlight module using same

A backlight module and backplane technology, which is applied in the field of backlight modules, can solve the problems that the heat of aluminum extrusion cannot be quickly transferred and the temperature of the backlight module is high, and achieve the effects of reducing material costs, reducing processing technology, and improving heat dissipation efficiency.

Inactive Publication Date: 2012-08-15
SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, due to the heat conduction between the aluminum extrusion and the backplane, the heat on the aluminum extrusion cannot be quickly transferred to the backplane, so that the heat of the aluminum extrusion is relatively concentrated, and the temperature inside the backlight module is relatively high.

Method used

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  • Back plate and backlight module using same
  • Back plate and backlight module using same
  • Back plate and backlight module using same

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings and preferred embodiments.

[0022] The present invention further illustrates the present invention by taking a low-cost frame-type backplane as an example. Of course, the present invention is also applicable to integrally formed backplanes, that is, suitable for such as figure 1 backplane shown.

[0023] Such as figure 2 Shown is an embodiment of the present invention, the framed backplane 100 includes: a left side bracket 101, a right side bracket 102, an upper side bracket 103, a lower side bracket 104 and a middle bracket 105, wherein the left side bracket 102 is the light incident side The bracket is used to fix the light source of the backlight module.

[0024] Such as image 3 and Figure 4 Shown is the left frame 101 of the frame-type backplane 100. As shown in FIG. The opposite inner surface of the wall 1011 is coated with a heat dissipation material coati...

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PUM

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Abstract

The invention discloses a back plate and a backlight module using the same. The back plate is composed of a plurality of brackets by splicing, wherein the plurality of brackets comprise an incident light side bracket for arranging a power supply; and the structural part of the incident light side bracket, which is provided with the light source, is coated by a heat radiation material. The part of the back plate, which is provided with the light source, is coated by the heat radiation material, so that the heat radiation efficiency of the part is improved; the heat of the part of the back plate, which is provided with the light source, can be rapidly dispersed out so as to reduce the temperature of the part and improve the heat radiation efficiency of the backlight module; therefore, the temperature in the backlight module is reduced and the problems that an assembly in the backlight module is damaged or the service life is influenced due to a higher temperature are avoided; and furthermore, the framework type back plate also can be used for reducing the machining process of the back plate and the material cost of the back plate.

Description

technical field [0001] The invention relates to the field of liquid crystal display, more specifically, to a backplane and a backlight module using the backplane. Background technique [0002] At present, it is known that TFT-LCD liquid crystal module mainly includes parts: front frame (Bezel), panel (Panel) and backlight module, and the backlight module includes light source (Back light), back plate and other parts. In addition to providing storage for optical film (film), light source, etc., the corresponding convex hull is formed on the back plate for locking and fixing the system end or Panel circuit board. [0003] Such as figure 1 Shown is the structure of an existing backplane. This kind of backplane is generally formed by integral stamping of metal materials. At the same time, structures such as convex bumps are formed on the top of the backplane during stamping for locking and fixing the system end or panel circuit board. In order to improve the heat dissipation c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V21/00F21V29/00F21S8/00G02F1/13357
CPCG02B6/0085G02F1/133308G02F1/133314G02F1/133628
Inventor 萧宇均郭仪正黄冲程加河张庞岭
Owner SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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