Mechanical detection method for workbench of automatic chip mounter and application

Abstract

The invention discloses a mechanical detection method for a workbench of an automatic chip mounter and the application of the method. A to-be-detected point or a to-be-detected surface on the workbench is taken as a detected object, the operation mode and the mounting frequency of a mounting head are set through a main-control system, the position of the to-be-detected point is detected in a repeated simulation mounting state through different fixing manners of a dial indicator, and the spacial position of the to-be-detected surface is detected continuously through a horizontal moving manner of the mounting head, so that the position change rule and the levelness condition of the workbench in the practical mounting process can be obtained, and the purpose of effectively detecting the workbench of the automatic chip mounter can be achieved. Through the detection result, the displacement compensation can be performed during the continuous mounting process of the mounting head in the later period, and the equipment calibration can be performed along with the ageing process in the prior period, so that accumulate errors possibly generated during the continuous mounting process can be eliminated effectively, the mounting quality and the mounting efficiency of the automatic chip mounter can be ensured, and the use requirement in the practical mounting process can be met.

Description

technical field [0001] The invention relates to a mechanical detection method for the workbench of an automatic placement machine and the extended application of the method, belonging to the technical field of electronic placement. Background technique [0002] In the field of electronic placement technology, the automatic placement machine is a key equipment. It uses the reciprocating movement of the placement head under the control of the chip, combined with the image acquisition and positioning of the optical lens at any time, to complete the picking of various electronic components, and After picking up and correcting, it is finally accurately mounted to the specified position on the circuit board. The placement process is accurate and fast, and the placement speed can reach tens of thousands or even hundreds of thousands of times per hour. The placement is completely automatic, which greatly improves the placement process of electronic components and ensures the quality...

AI Technical Summary

Problems solved by technology

The cumulative error is generated by the movement links such as the transmission screw and the transmission guide rail, and is accompanied by each placement process. In this way, as the number of placements continues to increase, the influence of the cumulative error gradually appears, the quality of the placement decreases, and the placement efficiency reduce

[0003] To avoid the generation of accumulative errors in the transmission system, it is impractical to simply improve the performance of the transmission structure, and the reference calibration of the origin position of the placement head in the process of picking up electronic components every time will seriously affect the placement speed and Mounting efficiency