Self-cleaning grinding and polishing tool

Abstract

The invention relates to a self-cleaning grinding and polishing tool, which relates to a grinding and polishing tool for self-cleaning overflow grinding and polishing liquid and grinding and polishing scraps through vacuum absorption while grinding and polishing a surface in the central liquid supplying process. The tool consists of a pressurization unit, a liquid supplying and cleaning unit and a grinding and polishing operation unit, wherein the pressurization unit is used for adjusting grinding and polishing pressure; the liquid supplying and cleaning unit is used for introducing grinding and polishing media and vacuumizing and absorbing the grinding and polishing media; and a grinding and polishing effect is achieved by the grinding and polishing operation unit. The grinding and polishing tool moves in a certain track under the control of a computer, so that a large plane can be totally flattened. The tool has the advantages that the grinding and polishing media are introduced into the center of a grinding and polishing head, so that the grinding and polishing media can be fully contacted with grinding and polishing materials, and the grinding and polishing quality and the grinding and polishing efficiency are improved; and by a vacuumized pore passage of an outer ring of the grinding and polishing tool, the grinding and polishing media which are subjected to a grinding and polishing process is sucked away in time, so that the ground and polished surface is prevented from being polluted, the effect of self-cleaning the surface of a workpiece in the grinding and polishing process is achieved, subsequent cleaning processes are eliminated, and processing efficiency is improved.

Description

technical field [0001] The invention relates to precision and ultra-precision grinding and polishing technology, in particular to a grinding and polishing tool which automatically cleans residual liquid and grinding debris spilled on the surface of a workpiece through vacuum adsorption while liquid is supplied from the center to realize grinding and polishing processing. Background technique [0002] For the ultra-precision machining of a class of deliquescent crystal materials, micro-nano deliquescent polishing based on the principle of water dissolution is an effective new principle and new method. The principle is to pour a liquid containing a small amount of water molecules into the interface between the polishing head and the workpiece , under the mechanical force, the "water-in-oil" structure is destroyed, and the water molecules perform local point-by-point micro-nano hydrolysis on the crystal material within the interface range between the polishing tool and the workp...

AI Technical Summary

Problems solved by technology

[0006] In the existing relevant patented technologies, there is no example of self-cleaning by vacuum adsorption and removal of overflowing grinding and polishing liquid and grinding and polishing tools while using central liquid-supply grinding and polishing tools for processing

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