Insulation structure used for fixing electronic element, electronic element and component

Abstract

The invention discloses an insulation structure used for fixing an electronic element, the electronic element and a component, relates to the field of communication, and has the advantages that the insulation distance can be extended, the insulation degree can be increased and the voltage withstanding grade can satisfy the requirement of insulation reinforcing. The insulation structure comprises a hollow first insulation member and a ring-shaped second insulation member, wherein the first insulation member comprises a thick part on the upper section and a thin part on the lower section; the outer diameter of the thick part is larger than the outer diameter of the thin part, and the inner diameter of the thick part is equal to the outer diameter of the thin part; the outer diameter size of the thin part satisfies the condition that when the thin part passes through a mounting hole of the electronic element, the outer surface of the thin part is attached to the mounting hole; the second insulation member is arranged in a mounting hole to be mounted on a heat dissipation plate; a mounting screw passes through the first insulation member; the thin part of the first insulation member passes through the mounting hole of the electronic element and the second insulation member; the second insulation member is jacketed at the thin part of the first insulation member; and the inner surface of the second insulation member is closely stuck to the outer surface of the thin part of the first insulation member. The insulation structure used for fixing the electronic element can improve the insulation effect of the electronic element.

Description

technical field [0001] The invention relates to the field of electronic circuits, in particular to an insulating structure for fixing electronic components, an electronic component and an assembly of electronic components. Background technique [0002] A field effect transistor (Metal Oxide Semiconductor, MOS) is an electronic component commonly used in modern industrial design. It is mainly used in digital logic circuits to realize switching logic, that is, logical 0 or 1. In practical applications, it is usually necessary to fix the MOS tube with screws, and at this time, the MOS tube must be insulated from the screws. [0003] Such as figure 1 As shown, in the prior art, the MOS tube 20 is fixed on the circuit board by screws 30 , and the circuit board is laid with a heat dissipation insulating pad 40 and a heat dissipation plate 50 . The screw 30 is separated from the MOS tube 20 by the insulating structure 11. The length of the broken line A in the figure is the insul...

AI Technical Summary

Problems solved by technology

[0005] The insulation distance is short, the insulation strength is not enough, it is easy to cause short circuit and fire, and damage the circuit board

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