Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Emulation verification method applied to mobile storage SOC (system on chip) chip

A mobile storage, simulation and verification technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of lack of design observation under test, lack of compatibility verification, etc., to shorten the development time and debugging time. Effect

Inactive Publication Date: 2012-07-04
BEIJING MXTRONICS CORP +1
View PDF3 Cites 18 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Lack of verification of compatibility, lack of observation of the design under test

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Emulation verification method applied to mobile storage SOC (system on chip) chip
  • Emulation verification method applied to mobile storage SOC (system on chip) chip
  • Emulation verification method applied to mobile storage SOC (system on chip) chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The present invention will be further introduced below in conjunction with the accompanying drawings.

[0026] Such as figure 1 The flow chart of the present invention is shown, including: the step of establishing a memory module; the step of establishing a compatibility generation mechanism; the step of establishing a detection point and the step of generating excitation data for detection. further as figure 2 As shown, the emulation verification platform that adopts the method of the present invention to form has been provided, including incentive generation module, bus function model, assertion checker, coverage model, memory model, compatibility generation mechanism, DUT (Design Under Test) is The tested mobile storage SOC chip.

[0027] The memory model is the FLASH memory simulation model provided by the manufacturer, or the memory model for simulation written by the developer himself. Generally, it is an HDL simulation model with timing characteristics. Chec...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an emulation verification method applied to a mobile storage SOC (system on chip) chip. The emulation verification comprises the following steps of: establishing a storage module, establishing a compatibility generation mechanism, establishing detection points and generating incentive data for detecting. Due to the adoption of the emulation verification method, function verification of the mobile storage SOC chip is realized.

Description

technical field [0001] The invention relates to a simulation verification method applied to mobile storage SOC chips, and belongs to the technical field of design verification. Background technique [0002] The rapid development of microelectronic technology represented by semiconductor integrated circuits has become the forerunner and cornerstone of modern information industry technology. Over the past few years, mobile storage products have been widely used in electronic products such as digital cameras / camcorders, mobile phones, and game consoles due to their small size, easy portability, and low cost. Products based on FLASH memory include U disk, USB card reader, FLASH memory card (SD card, MMC card, CF card, etc.), etc. [0003] Mobile storage products have the following characteristics: 1) Most of them are SOC system chips, which include both hardware and software parts. 2) All are multi-interface chips, and data is transmitted from one protocol layer to another pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 褚晓滨宗宇王莉张志永谷羽宋晶峰谢俊玲
Owner BEIJING MXTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products