Heat-conducting siliconfilm and manufacturing method thereof

Abstract

The invention relates to the technical field of heat-conducting siliconfilms, and discloses a heat-conducting siliconfilm and a manufacturing method of the heat-conducting siliconfilm. One surface of the heat-conducting siliconfilm is a viscous layer, the other surface of the heat-conducting siliconfilm is a non-viscous layer, the viscous layer comprises liquid state silicone, solid heat conduction powder and fire retardants, the non-viscous layer comprises high-temperature silicon disulfide rubber and solid heat conduction powder, and the high-temperature silicon disulfide rubber is rubber compound. When being used, the heat-conducting siliconfilm with the viscous layer at one surface and the non-viscous layer at the other surface is convenient to disassemble, the problem of non-uniform radiating of heterogeneous materials with different heat condition performances can not be worried when the siliconfilm is used, and as the heat amount is accumulated, the radiating effect of the siliconfilm is greatly enhanced. The coefficient of heat conductivity of the siliconfilm provided by the invention is more than 0.8W / m.K, and can reach more than 5W / m.K according to different types and quantities of the added solid heat conduction powder.

Description

technical field [0001] The invention relates to the technical field of heat-conducting silica gel, in particular to a heat-conducting silica gel roll and a manufacturing method thereof. Background technique [0002] All kinds of electronic products are widely used in my life, ranging from large TVs to small MP3 players. All electronic products will involve a problem of heat dissipation, because the temperature of the electronic components in electronic products will increase during use. Increase, especially transistors and some semiconductor components are particularly prone to heat. When these electronic components are at a high temperature, their performance will decrease. At this time, it is necessary to dissipate heat from these electronic components. [0003] Usually some large electronic products will be equipped with a fan for heat dissipation, but for some small electronic products, it is not practical to configure a fan, because there is not enough space inside thes...

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Problems solved by technology

[0003] Usually some large electronic products will be equipped with a fan for heat dissipation, but for some small electronic products, it is not practical to configure a fan, because there is not enough space inside these products to accommodate a fan. At this time, it is necessary to configure a smaller heat sink to dissipate heat. When connecting the heat sink to the heating element, it is usually necessary to use a silica gel sheet to conduct heat. The two sides of the ordinary silica gel sheet are sticky, but when When the application part of the heat conduction sheet needs to be detachable, the two sides of the heat conduction sheet need to have different viscosities. At this time, the common method is to add a layer of material of different materials on the other side of the heat conduction sheet, which may cause sticky surface and non-stick surface. Different thermal conductivity results in the accumulation of heat, which cannot be exported in a timely and effective manner.

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