Optical communication module

Abstract

Disclosed is an optical communication module in which the thickness of an electrically conductive plate such as a lead frame needs not to be reduced and the size of a lens needs not to be reduced when the size of a photoelectronic element such as a laser diode or a photo diode is reduced. A laser diode (20) is connected and fixed to an electrically conductive plate (60) that is arranged on the upper surface of a light-permeable light-passing table (70), and the light-passing table (70) is connected and fixed to an electrically conductive plate (30) that is arranged on the upper surface of a light-permeable base (10). A first lens (14) and a second lens (15) are respectively formed on the upper surface and the lower surface of the base (10) in an integral manner. The laser diode (20) enables the sending of an optical signal through a gap of the electrically conductive plate (60), the light-permeable light-passing table (70), an opening of an electrically conductive plate (65), an opening (31) of the electrically conductive plate (30), the first lens (14), the light-permeable base (10) and the second lens (15).

Description

technical field [0001] The present invention relates to an optical communication module that encapsulates components such as laser diodes and / or photodiodes for optical communication. Background technique [0002] Currently, optical communication using optical fibers or the like is widely spread. Optical communication is carried out by converting electrical signals into optical signals through light-emitting elements such as laser diodes, receiving and receiving optical signals through optical fibers, and converting received optical signals into electrical signals by light-receiving elements such as photodiodes (hereinafter, these light-emitting elements and light-receiving elements are called for optoelectronic components). Therefore, an optical communication module in which a photoelectric element such as a laser diode and / or a photodiode and peripheral circuit elements for operating the photoelectric element are used as one package is widely used. The optical communicat...

AI Technical Summary

Problems solved by technology

In order to form the opening 31 with a short width with high precision, it is necessary to reduce the thickness of the conductive plate 30. However, since one end of the conductive plate 30 is exposed outside the OSA1 and constitutes a connection terminal with an external device, there is a problem due to the thinning of the conductive plate 30. , the strength of the connection terminal may decrease, and the problem of difficulty in thinning

[0014] In addition, since the upper side of the base 10 of OSA1 on which the laser diode 20 is mounted and the lower side opposite to it are molded by different molds, the diameter ratio of the first lens 14 integrally formed on the upper side of the base 10 cannot be made conductive. The width of the opening 31 of the plate 30 is large

Therefore, when the width of the opening 31 of the conductive plate 30 becomes narrow along with the miniaturization of the laser diode 20, the first lens 14 must be miniaturized, and the accuracy of optical communication may decrease.

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