Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

IC (Integrated Circuit) card remaking device

A technology for refurbishing devices and recycling devices, applied in grinding devices, grinding machine tools, metal processing equipment, etc., can solve the problems of no treatment method, affecting the appearance, environmental pollution, etc., to prevent damage to IC cards, saving resources, and long service life Effect

Inactive Publication Date: 2012-05-30
SHANGHAI SAIKADE TECH DEV
View PDF6 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the service life of domestic and even international IC cards can reach 100,000 times according to the design requirements, but in the process of use, the pattern is worn, the surface is oily, and it is reported that the bacteria on the surface of the IC card is more than RMB (expressway pass card, subway one-way) Tickets) affect the appearance, and the health of the user or need to replace the surface pattern, when such a situation occurs, so far there is no good way to deal with it, only to discard the old card and make a new card, which not only wastes a lot of money resources, but also cause great pollution to the environment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • IC (Integrated Circuit) card remaking device
  • IC (Integrated Circuit) card remaking device
  • IC (Integrated Circuit) card remaking device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Such as figure 1 with figure 2 As shown, the IC card refurbishment device of the embodiment of the present invention comprises workbench 1, control unit 2 and the grinding mechanism 3 that is located on the workbench 1, and grinding mechanism 3 comprises lower grinding disc unit 31 and upper grinding disc unit 32, lower grinding disc unit 31 Comprising a lower grinding disc 311 and a lower grinding disc motor 312 for driving the lower grinding disc 311 , the upper grinding disc unit 32 includes a lifting mechanism 323 , an upper grinding disc 321 and an upper grinding disc motor 322 for driving the upper grinding disc 321 , and the upper grinding disc 321 is fixed on the workbench 1 through the lifting mechanism 321 The upper and lower grinding disc motors 312 , the upper grinding disc motor 322 and the lifting mechanism 321 are all connected to the control unit 2 .

[0028] In this embodiment, the lower millstone unit 31 includes a lower millstone pressure sensor 313...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an IC (Integrated Circuit) card remaking device, which comprises a workbench (1), a control unit (2) and a grinding mechanism (3), wherein the grinding mechanism (3) is arranged on the workbench (1), and comprises a lower grinding disc unit (31) and an upper grinding disc unit (32); the lower grinding disc unit (31) comprises a lower grinding disc (311) and a lower grinding disc motor (312) for driving the lower grinding disc (311); the upper grinding disc unit (32) comprises an elevating mechanism (321), an upper grinding disc (321) and an upper grinding disc motor (322) for driving the upper grinding disc (321); the upper grinding disc (321) is fixed on the workbench (1) through the elevating mechanism (321); and the lower grinding disc motor (312), the upper grinding disc motor (322) and the elevating mechanism (321) are connected with the control unit (2). Due to the adoption of the IC card remaking device, card replacement cost is saved; and the IC card remaking device has the advantages of good grinding effect, saving in resources and long service life of a remade card.

Description

technical field [0001] The invention relates to a device for refurbishing various IC cards. Background technique [0002] At present, the service life of domestic and even international IC cards can reach 100,000 times according to the design requirements, but in the process of use, the pattern is worn, the surface is oily, and it is reported that the bacteria on the surface of the IC card is more than RMB (expressway pass card, subway one-way) Tickets) affect the appearance, and the health of the user or need to replace the surface pattern, when such a situation occurs, so far there is no good way to deal with it, only to discard the old card and make a new card, which not only wastes a lot of money resources, but also cause great pollution to the environment. [0003] The purpose of the process of the present invention is to apply advanced technology to surface wear, oil stains and cards that need to be replaced with new patterns (without damaging the internal chip of the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00
Inventor 曹戊斌
Owner SHANGHAI SAIKADE TECH DEV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com