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Heat dissipation coating agent and heat-dissipating plate including same

A coating agent and heat dissipation plate technology, applied in coating, cooling/ventilation/heating modification, electrical components, etc., can solve the problems of high thermal conductivity, low aluminum radiation rate, etc., and achieve heat dissipation and practical application Effect

Inactive Publication Date: 2012-05-23
KOREA ELECTROTECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high thermal conductivity of aluminum, the heat transfer from the heat source to the surface is very smooth, but because the emissivity of aluminum is lower than 30%, most of the heat dissipation on the surface depends on air convection. Therefore, when using LEDs for When lighting instruments with high power, there is still a heat dissipation problem

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] In order to understand the heat dissipation effect of the heat dissipation coating agent, it is divided into three cases: coating the surface of the aluminum heat dissipation plate of the 40W LED with heat dissipation coating agent and uncoated and anodizing the surface of the heat dissipation plate. How much the temperature of the PCB substrate is lowered.

[0033] The heat-dissipating coating agent used here is mixed with 100 parts by weight of a silicon compound binder infrared radiator powder (jade: 20-30%; SiC: 50-70%; cordierite: 10-20%; tin oxide: 1 to 3%; manganese dioxide: 1 to 5%) 150 parts by weight and 50 parts by weight of toluene for viscosity reduction were mixed with a ball mill for 2 hours. The surface of the heat dissipation plate was coated with the prepared heat dissipation coating agent by a dipping method.

[0034] The temperature measurement results of the upper end of the PCB of the LED are as follows:

[0035] ——Sample 1: Without any treatment...

Embodiment 2

[0040] In order to understand the heat dissipation effect of the heat dissipation coating agent, it is divided into three cases: coating the surface of the aluminum heat dissipation plate of the 40W LED with heat dissipation coating agent and uncoated and anodizing the surface of the heat dissipation plate. How much the temperature of the PCB substrate is lowered.

[0041] The heat-dissipating coating agent used here is mixed with 100 parts by weight of epoxy organic binder (main material: 100%; hardener: 30%) infrared radiator powder (jade: 20-30%; SiC: 50- 70%; cordierite: 10-20%; sericite: 1-3%; carbon: 1-3%; manganese dioxide: 1-5%) 150 parts by weight and 50 parts by weight of toluene for reducing viscosity and using a ball mill Mix for 2 hours. The surface of the heat dissipation plate was coated with the prepared heat dissipation coating agent by a dipping method.

[0042] The temperature measurement results of the upper end of the PCB of the LED are as follows:

[0...

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Abstract

The present invention relates to a heat dissipation coating agent and to a heat-dissipating plate including same, which efficiently dissipate heat from the surface of a heat-dissipating plate of an electric / electronic component. Particularly, the heat dissipation coating agent, which is applied to the surface of a heat-dissipating plate of an electric / electronic component, includes infrared radiation powder and a binder, and the heat-dissipating plate is coated with a heat dissipation layer consisting of the heat dissipation coating agent. Since the heat dissipation coating agent applied to the heat-dissipating plate is highly conductive, heat is emitted from the heat-dissipating plate by conduction as well as convection. In particular, the heat dissipation coating agent, which conducts heat with high conductivity, can be applied to a heat-dissipating plate of a high-power LED light source.

Description

technical field [0001] The invention relates to a heat dissipation coating agent, which coats a high emissivity material with high emissivity on the surface of a heat dissipation plate of an electrical and electronic component to achieve effective heat dissipation on the electrical and electronic component through convection and radiation, and utilizes the heat dissipation Coating agent for heat sinks. Background technique [0002] The generated heat often has a bad influence on itself or surrounding parts, so as to reduce the performance or shorten the life. In order to improve such a phenomenon, natural cooling is generally performed by a water-cooling method using a solvent such as water forcibly reducing the heat of the surface or increasing the surface area by a convection phenomenon of air. In the case of the water-cooling method, although the cooling effect is very good, many devices such as additional equipment for circulating water and equipment for storing water a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D183/00C09D201/00C09D5/00H05K7/20
CPCC08K3/04C08K3/22C08K3/34C08K3/14C09D183/00C09D1/00H01L23/3737C08K3/24H01L23/36C09D7/1216H01L2924/0002C09D7/61Y10T428/31522Y10T428/31663Y10T428/31529Y10T428/31511Y10T428/31525Y10T428/31667Y10T428/31518H01L2924/00
Inventor 朴孝律安明尚姜东俊郑大勇
Owner KOREA ELECTROTECH RES INST
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