Printed circuit board, tinning line thereof and tinning method thereof

Abstract

An embodiment of the invention discloses a printed circuit board, a tinning line thereof and a tinning method thereof, relating to the microelectronic technology field, and welding looseness and tinning unevenness caused by soldering tin mobility can be avoided. The printed circuit board tinning line comprises a plurality of tinning strips which are uniformly distributed. The tinning strips are mutually independent and do no contact each other. The printed circuit board, the tinning line and the tinning method are applied to printing of the printed circuit board.

Description

Technical field [0001] The invention relates to the field of microelectronics, in particular to a printed circuit board and its tin hanging circuit and tin hanging method. Background technique [0002] In the manufacturing process of a printed circuit board (PCB), generally, a wave soldering process is used for hanging tin. [0003] Wave soldering is to make the soldering surface of the plug-in board directly contact the high-temperature liquid tin to achieve the purpose of soldering. The high-temperature liquid tin maintains a slope, and a special device makes the liquid tin form a wave-like tin hanging circuit. Such as figure 1 As shown, the PCB tin hanging circuit 1 provided by the prior art is not tin hanging or a wide tin strip is used to directly penetrate the whole tin hanging circuit 1. During the wave soldering process, it is easy to cause uneven tin application, and in some places Thick, thin in some places, but in the case of high current, the thin place generates a lot...

AI Technical Summary

Problems solved by technology

like figure 1 As shown, the PCB soldering line 1 provided by the prior art is not tinned or a wide tin strip is used to directly run through the entire soldering line 1. When the wave soldering process is performed, it is easy to cause uneven tinning, and in some places Thick, some places are thin, and in the case of high current, the thin place generates a lot of heat, which makes the temperature rise of the whole PCB higher, which is not conducive to heat dissipation, causing safety hazards; and, at the junction of the tin-hanging line and the component pad place, such as figure 1 As shown, if the tin-hanging line 1 is connected to the component pad 2, since the solder is flowing, the solder will move along the slope of the tin during wave soldering, resulting in less tin in the component pad 2, which affects Soldering firmness, while the soldering line 1 is not full and uniform enough, which will eventually affect the quality of tinning

If the tin-hanging line 1 is separated from the component pad 2, only the copper foil 3 at the separation gap bears the current impact pressure. In the case of high current, the line is prone to blown out, causing potential safety hazards

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