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Method and device for reducing volatile matters of o-cresol-formaldehyde epoxy resin

A novolac epoxy resin and volatile content technology, which is applied in the direction of separation methods, chemical instruments and methods, evaporation, etc., can solve the problems of reducing the volatile content of epoxy resin products, methods or devices, and has not been seen, so as to increase resin film formation Surface area, improvement effect, effect of reducing volatile matter

Active Publication Date: 2012-05-23
CHINA PETROCHEMICAL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, there is no patent on the method or device for reducing the volatile content of epoxy resin products

Method used

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  • Method and device for reducing volatile matters of o-cresol-formaldehyde epoxy resin
  • Method and device for reducing volatile matters of o-cresol-formaldehyde epoxy resin
  • Method and device for reducing volatile matters of o-cresol-formaldehyde epoxy resin

Examples

Experimental program
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Embodiment 1

[0036] The structure of horizontal pipe mixer, vertical pipe mixer and packed tower are as follows: Figure 1-3 shown.

[0037] The filler in the horizontal pipeline mixer can make the refluxed liquid phase and the resin solution two kinds of materials with different viscosities evenly mixed, so that the material entering the falling film evaporator can form a uniform film, improve the effect of reflux and reprocessing, and at the same time improve the feed rate. The role of temperature.

[0038] The vertical pipeline mixer makes the water vapor and the resin flow in the same direction, and is condensed and discharged together with the volatile matter in the condenser through the wiped film evaporator.

[0039] The packed tower makes the heated nitrogen and resin flow in reverse, and is discharged from the exhaust port of the vacuum pump through the wiped film evaporator.

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Abstract

The invention discloses a method and device for reducing volatile matters of an o-cresol-formaldehyde epoxy resin. The method comprises the following step of: performing a two-stage desolventizing step, including a coarse desolventizing step and a fine desolventizing step to remove a solvent and a high-boiling residue component from an o-cresol-formaldehyde epoxy resin. The device comprises a feed pump, a first pipeline mixer, a falling film evaporator, a gas-liquid separator, a primary removal extraction pump, a second pipeline mixer, a thin-film evaporator, a packing tower and a secondary removal extraction pump which are connected in sequence, wherein a part of an o-cresol-formaldehyde epoxy resin solution output by the gas-liquid separator returns to the first pipeline mixer through areflux pump; a steam inlet / outlet is formed in the second pipeline mixer; and both the gas-liquid separator and a film evaporator are provided with a volatile matter gas-phase outlet. According to the method and the device for reducing the volatile matters of the o-cresol-formaldehyde epoxy resin, volatile matters of a product can be reduced to be below 0.05 percent, and the performance of the product applied to an electronic molding compound can be improved remarkably.

Description

technical field [0001] The invention relates to a method and a device for reducing the volatile content of o-cresol novolak epoxy resin. technical background [0002] With the development of electronic industry technology, the demand for integrated circuit packaging materials is increasing sharply. Its main applications include: computers, network equipment, automatic control devices, communication equipment and consumer electronics products. In order to meet the needs of high functionality, lightness, thinness, and miniaturization of these products, electronic components are gradually moving toward super-large integration scale, nano-sized wiring width, miniaturized package size, high-density component installation, and automation of processing and component installation. . In order to meet the needs of high density, to avoid defects such as tiny bubbles during the processing of component packaging materials, and to reduce the failure rate of components as much as possible...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/00B01D1/22B01D1/26
Inventor 唐光斌杨林胡学辉刘帅吴际伟
Owner CHINA PETROCHEMICAL CORP
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