Circuit diagram rewiring method

Abstract

The invention provides a circuit diagram rewiring method comprising the following steps of: obtaining at least one pair of paired signal wires from a circuit diagram wired previously, wherein the circuit diagram wired previously is laid on a substrate of a printed circuit board; the substrate is provided with a plurality of warps and a plurality of wefts; the at least one pair of paired signal wires includes two signal wires parallel to each other; and the paired signal wires include a plurality of pairs of paired segments; determining whether there is at least one pair of parallel segments among the paired segments which is parallel to the warp or the weft; and if there is at least one pair of parallel segments, replacing at least one pair of parallel segments on the circuit diagram wired previously by a plurality of pairs of ten-degree wires, wherein the ten-degree wire forms an angle of ten degrees with the warp or the weft.

Description

technical field [0001] The present invention relates to a wiring method, and more particularly to a circuit diagram rewiring method. Background technique [0002] In order to simplify the production of electronic machines, reduce the wiring between electronic parts, and reduce production costs, people began to study the method of replacing wiring with printing, thus producing printed circuit boards (Printed Circuit Board, PCB), or called It is a printed circuit board (Printed Wire Board, PWB). Printed circuit boards are important electronic components used to provide circuit connections for electronic components. Among them, the traditional circuit board adopts the method of printing etch resist to make the circuit line and picture surface, so it is called printed circuit board or printed circuit board. Due to the continuous miniaturization and refinement of electronic products, most of the current circuit boards are made by attaching etch resist (lamination or coating), a...

AI Technical Summary

Problems solved by technology

Therefore, if the paired signal wires 120 and 130 are wired on the substrate 110 in a direction parallel to the weft wire 112 (such as figure 1 As shown), the paired signal lines 120 and 130 will be affected by the uneven surface when transmitting the paired signal, and have different delay times

In addition, in other examples, if the paired signal lines 120 and 130 are routed on the substrate 110 parallel to the warp line 111, the paired signal lines 120 and 130 will also have different delays when transmitting the paired signals. time

In today's situation where the signal speed is getting faster and faster, the delay time of the paired signals is different and it is easy to cause signal transmission errors

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