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Cooling device and electronic device using same

A technology for heat sinks and electronic components, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of high cost and heavy weight, and achieve the effects of weight reduction, cost saving, height and length reduction

Inactive Publication Date: 2012-04-18
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, as electronic products such as notebook computers are becoming thinner and thinner today, setting up a large number of heat dissipation modules in a limited space is not only costly and heavy, but also easily interferes with other components.

Method used

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  • Cooling device and electronic device using same
  • Cooling device and electronic device using same
  • Cooling device and electronic device using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0060] figure 1 and figure 2 Shown is an electronic device 100 according to an embodiment of the present invention. The electronic device 100 includes a heat dissipation device 10 , a circuit board 20 , and a first electronic component and a second electronic component disposed on the circuit board 20 at intervals. The heat dissipation device 10 is used for dissipating heat from the first electronic component and the second electronic component, and the heat generated by the first electronic component is greater than the heat generated by the second electronic component. In this embodiment, the first electronic component is a central processing unit 21 , and the second electronic component is a graphics card 22 .

[0061] The cooling device 10 includes a first heat pipe 11, a centrifugal fan 12, a cooling fin set 13, a wind guide cover 14 which is arranged on the periphery of the centrifugal fan 12 and the cooling fin set 13, a second heat pipe 15, A connecting piece 16 co...

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Abstract

The invention relates to a cooling device, which comprises a cooling fin group, a first heat pipe, a second heat pipe and a centrifugal fan, wherein the centrifugal fan is provided with an air outlet; the cooling fin group is arranged at an air outlet of the centrifugal fan; the first heat pipe comprises a first evaporating section in thermal contact with an electronic element and a first condensing section extending from the first evaporating section; the second heat pipe comprises a second evaporating section in thermal contact with another electronic element and a second condensing section extending from the second evaporating section; the first condensing section is thermally connected with the cooling fin group; and the second condensing section is lapped with the first heat pipe and is in thermal contact with the first heat pipe. According to the cooling device disclosed by the invention, the second heat pipe is lapped on the first heat pipe, number of cooling modules can be reduced, height and length of the cooling fin group can be reduced, cost is saved, and weight of an electronic device is lightened. The invention also relates to the electronic device using the cooling device.

Description

technical field [0001] The invention relates to a cooling device, in particular to a cooling device for cooling electronic components. The invention also relates to an electronic device using the cooling device. Background technique [0002] At present, in electronic products such as notebook computers, in addition to the central processing unit, the heat generated by other electronic components such as graphics cards during the working process continues to increase. Therefore, while cooling the central processor, it is also necessary to dissipate heat from other electronic components such as graphics cards . [0003] Traditionally, multiple heat dissipation modules can be used to dissipate heat from these heat-generating electronic components respectively. Usually, each heat dissipation module includes a base plate, a set of heat dissipation fins fixed on the base plate, and a heat pipe embedded in the base plate and interposed between the base plate and the set of heat s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20H01L23/427H01L23/467
Inventor HUANG QINGBAIHONG RUIWEN
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD
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