Internal-cooled heat-blocking modular laser packaging system

Abstract

Provided is an internal laser module, which has substantially the same high performance as a conventional internal-cooled laser module and also has the advantages of improved cost efficiency and manufacturability. In the internal-cooled laser module, laser subassemblies of a coaxial semiconductor laser are arranged on a thermoelectric cooler cooling substrate which is packaged in a box with appropriate patterns. The thermoelectric cooler cooling substrate has several other assembles. The technology and the design principle are suitable to increase the heat insulation and photoelectric parameters of the internal-cooled laser module, so as to increase or optimize the performance stability of a laser within the wide temperature dynamic range.

Description

[0001] Cross References to Related Applications [0002] This application claims priority and the benefit of U.S. Provisional Patent Application No. 61 / 337,059, filed August 25, 2010, and entitled "Internal Cooled, Thermally Enclosed Modular Laser Packaging System," and incorporated herein by reference It serves as a reference. Background technique [0003] Semiconductor lasers are used in a wide variety of applications. The performance of semiconductor lasers is affected by temperature changes. If the ambient temperature changes, the optical and electrical parameters of the semiconductor laser will also change and deteriorate the performance of the laser. To meet application conditions and needs for operation over a wide temperature range, semiconductor lasers are typically packaged and classified into three main cooling types, namely uncooled, internally cooled, and externally cooled. Simply put, an uncooled system consists of a laser chip and optics mounted in the same h...

AI Technical Summary

Problems solved by technology

However, externally cooled laser packages do not work as well at excessive temperatures as internally cooled packages

For example, the butterfly laser package can easily obtain a temperature difference of 50°C between the laser chip and the surrounding environment, such as figure 1 As shown in curve 2, in comparison, traditional externally cooled laser packages can only achieve temperature differences of 30°C or less

This configuration also results in the TEC operating inefficiently and thus dissipating significantly more power than the butterfly laser package

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