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Flux composition for lead-free solder, and lead-free solder composition

A lead-free solder and composition technology, applied in the preparation of organic compounds, welding/cutting media/materials, soldering media, etc., can solve problems such as complex fixing processes, and achieve suppression of void generation, prevention of curing inhibition, and excellent wetting sexual effect

Active Publication Date: 2012-03-07
ARAKAWA CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the fixing process is complicated, and it is necessary to use a flux composition whose residue can be removed by washing etc.

Method used

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  • Flux composition for lead-free solder, and lead-free solder composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066]A flux composition for cream solder was prepared by mixing the following components: 40.2% by weight of hydrogenated acrylic acid-modified rosin (manufactured by Arakawa Chemical Industry Co., Ltd.); composition: 19% by weight of dehydroabietic acid, 10% by weight of dihydroabietic acid, 10 wt% tetrahydroabietic acid, 15 wt% hydrogenated rosin acrylic acid adduct and rosin acrylic acid adduct 41 wt%, 1.3 wt% dibromosuccinic acid (manufactured by Aldrich), 3.2 wt% glutaric acid (Tokyo Chemical Co., Ltd.), 4 wt% trans-2,3-dibromo-2-butene-1,4-diol (Tokyo Chemical Co., Ltd.), 10 wt% amine (Lion Akzo Co. , Ltd.), 35.3 wt% of diethylene glycol monohexyl ether (manufactured by Nippon Emulsifier Co., Ltd.), and 6 wt% of thixotropic agent (MA-WAX-O (manufactured by Kawaken Fine Chemical Co., Ltd.)) .

[0067] The flux composition thus obtained was used together with a solder alloy comprising 96.5 wt% Sn, 3.0 wt% Ag and 0.5 wt% copper to prepare a cream solder having a particle ...

Embodiment 2

[0069] Solder cream was obtained in the same manner as in Example 1, except that acrylic acid-modified rosin (manufactured by Arakawa Chemical Industry Co., Ltd.); composition: 19 wt % of dehydroabietic acid, 10 wt % of dihydroabietic acid, 10 wt % % tetrahydroabietic acid and 56wt% rosin acrylic acid adduct) to replace hydrogenated acrylic acid modified rosin (Arakawa Chemical Industry Co., Ltd.); composition: 19wt% dehydroabietic acid, 10wt% dihydroabietic acid, 10wt% % tetrahydroabietic acid, 15 wt% hydrogenated rosin acrylic acid adduct and 41 wt% rosin acrylic acid adduct) were used as rosin derivation components.

Embodiment 3

[0071] Solder cream was obtained in the same manner as in Example 1, except that the same hydrogenated acrylic acid-modified rosin and dehydroabietic acid-rich disproportionated rosin (manufactured by Arakawa Chemical Industry Co., Ltd.; composition: 80 wt% of dehydroabietic acid, 8 wt% of dihydroabietic acid, and 12 wt% of tetrahydroabietic acid; hereinafter referred to as "disproportionated rosin") each replaced 40.2 wt% of hydrogenated acrylic acid-modified rosin in an amount of 20.1 wt%. Arakawa Chemical Industry Co., Ltd.; composition: 19 wt% of dehydroabietic acid, 10 wt% of dihydroabietic acid, 10 wt% of tetrahydroabietic acid, 15 wt% of hydrogenated rosin acrylic acid adduct, and 41 wt% of rosin acrylic acid adduct compounds) are used as rosin-derived components.

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PUM

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Abstract

Disclosed is a flux composition for a lead-free solder, which is characterized by containing components derived from rosins. The components derived from rosins include a (meth)acrylic acid-modified rosin, dehydroabietic acid and dihydroabietic acid; and the dehydroabietic acid content is 7-65% by weight and the dihydroabietic acid content is 3-57% by weight with respect to the total amount of the components derived from rosins. Also disclosed is a lead-free solder composition which contains the flux composition and a lead-free solder alloy.

Description

technical field [0001] The present invention relates to a flux composition for lead-free solder and a lead-free solder composition. Background technique [0002] Paste solder is a kneaded mixture of solder powder and liquid flux, and is widely used to attach electronic components such as resistors, capacitors, and ICs to printed circuit boards. [0003] Fluxes are usually prepared by mixing a base resin with solvents, activators, thixotropes and other additives. As the base resin, rosin-based resins are used because of their excellent properties such as corrosion resistance and insulation resistance and their function of preventing re-oxidation of the metal to be welded, and examples of such rosin-based resins include natural rosin, polymerized rosin, hydrogenated rosin , Disproportionated rosin, maleic acid modified rosin, acrylic acid modified rosin and esterified rosin. As the solvent, alcohols, esters, pyrrolidones and the like have been used. As the activator, amine ...

Claims

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Application Information

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IPC IPC(8): B23K35/363
CPCB23K35/262B23K35/025B23K35/3612B23K35/362C07C51/00C08L93/04C08L2205/03C09F1/04
Inventor 岩村荣治北浦知宪
Owner ARAKAWA CHEM IND LTD
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