Austenite stainless steel thin strip for electronic product shell
A technology of austenitic stainless steel and electronic products, which is applied in the field of stainless steel alloys, can solve the problems of not being able to meet the needs of use, achieve good polishing performance, and improve the overall performance
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Embodiment 1
[0020] A thin strip of austenitic stainless steel used for housings of electronic products, the austenitic stainless steel contains the following components by weight percentage: C 0.06%, Cr 16.5%, Ni 11.0%, Mn 1.8%, Si 0.3%, Mo 0.8%, Nb 0.3%, B 0.005%, Al 0.010%, N 0.20%, P≤0.03%, S≤0.005%, O≤0.0050%; the balance is Fe and unavoidable impurities; and the Ni- The range of bal is 1.5, and the Ni-bal is calculated by the following formula: Ni-bal%=Ni%+30(C%+N%+B%)+0.5Mn%-1.5(Cr%+1.5Si%+Mo %+0.5Nb%)+8.5%.
Embodiment 2
[0022] A thin strip of austenitic stainless steel used for housings of electronic products, the austenitic stainless steel contains the following components by weight percentage: C 0.08%, Cr 14.5%, Ni 13.0%, Mn 1.4%, Si 1.0%, Mo 0.5%, Nb 0.6%, B 0.001%, Al 0.060%, N 0.05%, P≤0.03%, S≤0.005%, O≤0.0050%; the balance is Fe and unavoidable impurities; and the Ni- The range of bal% is 0.93, and the described Ni-bal% is calculated by the following formula: Ni-bal%=Ni%+30(C%+N%+B%)+0.5Mn%-1.5(Cr%+1.5Si% +Mo%+0.5Nb%)+8.5%.
Embodiment 3
[0024] A thin strip of austenitic stainless steel for electronic product casings, the austenitic stainless steel contains the following components by weight percentage: C 0.07%, Cr 15.5%, Ni 12%, Mn 1.6%, Si 0.7%, Mo 0.6%, Nb 0.5%, B 0.004%, Al 0.04%, N 0.12%, P≤0.03%, S≤0.005%, O≤0.0050%; the balance is Fe and unavoidable impurities; and the Ni- The range of bal% is 1.0, and the described Ni-bal% is calculated by the following formula: Ni-bal%=Ni%+30(C%+N%+B%)+0.5Mn%-1.5(Cr%+1.5Si% +Mo%+0.5Nb%)+8.5%.
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