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Buffer material for hot press and application of buffer material

A buffer material and hot press technology, applied in the field of buffer materials, can solve problems such as deterioration, high production costs, and increased restrictions on hot pressing procedures

Active Publication Date: 2012-02-08
TECH ADVANCE IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the above-mentioned cushioning materials using composite materials not only have high production costs, but also inevitably increase the constraints of the hot-pressing process, and are prone to have many defects in actual use due to the differences in the characteristics of the components themselves.
For example, due to the different thermal conductivity of different components, when the above-mentioned buffer material using composite materials is used in a hot press, it is often easy to cause thermal energy transfer to be affected by material differences and cannot be uniformly transferred to the laminate to be processed The entire surface of the board material; and because the durability of various material components is bound to be different, it is easy to affect the overall heat conduction of the buffer material due to the rapid deterioration of the elastic coefficient of the material in a hot-pressed environment during long-term actual use. Cushioning effect and service life

Method used

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  • Buffer material for hot press and application of buffer material
  • Buffer material for hot press and application of buffer material
  • Buffer material for hot press and application of buffer material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1a

[0041] Use MPIA fiber (glass transition temperature about 270 ° C) as the material of the base layer, the fixed thread and the first fiber, and the fixed thread is used to fix the first fiber on the base layer by knitting to form a density of about 0.4 g / cm3. And the buffer material with a basis weight of about 1400 g / m2 (thickness about 3.5 mm), and the buffer material is placed in the figure 1 Heat press 1 shown. The temperature of the heating plate 111 is set to about 200°C, so as to provide a heat treatment temperature of about 180°C on the surface of the steel sheet 171 in contact with the laminate material 191. When the temperature of the steel sheet 171 reaches the heat treatment temperature of about 180°C, the A pressure of about 8 kg / cm 2 is applied to the heating plates 111 on both sides, so that the steel plate 171 is brought into contact with the laminated plate material 191, and the hot pressing procedure of the base plate material is carried out for about 90 minu...

Embodiment 1b

[0043] The hot pressing procedure of the laminate material 191 was performed with the same hot pressing machine and hot pressing conditions as in Example 1a, but the basis weight of the buffer material was adjusted to be about 1600 g / m2 (thickness about 4.0 mm). In the first hot pressing procedure, the heating rate of the surface of the steel sheet 171 in contact with the laminate material 191 from normal temperature to a heat treatment temperature of about 180°C was measured; and the hot pressing procedure was repeated, and in the 200th hot pressing procedure, The temperature increase rate of the surface of the steel sheet 171 in contact with the laminate material 191 from normal temperature to a heat treatment temperature of about 180°C. The measurement results are recorded in Table 1.

Embodiment 1c

[0045] The hot pressing procedure of the laminate material 191 was performed with the same hot pressing machine and hot pressing conditions as in Example 1a, but the basis weight of the buffer material was adjusted to about 1800 g / m2 (thickness about 5.3 mm). In the first hot pressing procedure, the heating rate of the surface of the steel sheet 171 in contact with the laminate material 191 from normal temperature to a heat treatment temperature of about 180°C was measured; and the hot pressing procedure was repeated, and in the 200th hot pressing procedure, The temperature increase rate of the surface of the steel sheet 171 in contact with the laminate material 191 from normal temperature to a heat treatment temperature of about 180°C. The measurement results are recorded in Table 1.

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Abstract

The invention discloses a buffer material for a hot press. The buffer material comprises a base layer, a fixing line and first fibers consisting of a single component substantially. The buffer material has reversible deformation capacity under the operating conditions of the hot press. The first fibers are fixed on the base layer in a knitting mode by means of the fixing line, and nonwoven cloth with the density of about 0.1-3.0 grams per cubic centimeter is formed; the base layer and the fixing line respectively independently consist of one or more kinds of fibers of which the glass transition temperature is more than or equal to that of the first fibers; and the first fibers account for more than or equal to 70 weight percent of the buffer material. The invention also provides application of the buffer material for the hot press.

Description

technical field [0001] The present invention relates to a buffer material for a hot press and its application; in particular, the present invention relates to a buffer material mainly composed of a single polymer fiber and having a non-woven structure and its application. Background technique [0002] The laminate is a composite layer structure formed by a hot pressing process, such as a flexible printed circuit board, an IC carrier board, a multi-layer wiring board, a printed circuit board, a copper foil base board, and the like. Taking a printed circuit board (PCB) as an example, it is formed by bonding multiple layers of films, insulating layers, adhesive layers and metal layers through a hot pressing process. In the hot pressing process, the control of temperature and pressure is extremely important, which not only directly affects the bonding effect between the layers of the resulting laminate, but also further affects the physical and electrical properties of the resul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B38/18
Inventor 黄俊智
Owner TECH ADVANCE IND
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