Method for optimizing integrated circuit layout heat distribution

Abstract

The invention relates to a method for optimizing integrated circuit layout heat distribution, which belongs to the field of integrated circuit design automation. The method comprises the following steps of: inputting a circuit netlist, a circuit simulation result, a physical layout of a circuit and a physical design rule of the circuit; performing circuit analysis to determine a key apparatus anda key net in the circuit; setting a filling barrier on the physical layout of the circuit according to the physical design rule of the circuit; performing heat analysis to determine a key heat point on the physical layout of the circuit; adding a heat-conduction passage for the key heat point, filling dumb metal patterns on a metal layer according to the heat-conduction passage and the physical design rule of the circuit, and additionally forming dumb metal through holes according to the heat-conduction passage and the physical design rule so as to connect the dumb metal patterns on the heat-conduction passage until the physical layout heat distribution of the circuit cannot be optimized through new dumb metal filling; and outputting the filled metal patterns to a physical layout database. The heat distribution of the integrated circuit physical layout can be effectively optimized through dumb metal filling.

Description

technical field [0001] The invention relates to the field of integrated circuit design automation, in particular to a method for optimizing heat distribution of an integrated circuit layout. Background technique [0002] In integrated circuit design, the characteristics of devices are very sensitive to temperature. Changes in temperature will cause obvious changes in device characteristics, which in turn will lead to obvious changes in upper circuit performance and even changes in circuit functions. Therefore, determining a reasonable temperature distribution is crucial to ensure all It is critical that the designed circuit work properly. There are two main ways to determine a reasonable temperature distribution, one is to optimize the distribution of heat sources, and the other is to optimize the heat flow path. [0003] In the existing integrated circuit design process, the optimization of thermal distribution is mainly considered and realized in the stage of physical lay...

AI Technical Summary

Problems solved by technology

From the perspective of integrated circuit design process, it is not enough to consider thermal optimization only in the stage of layout planning and device layout, and it cannot effectively optimize the thermal distribution on the physical layout of integrated circuits, reduce the distribution of hot spots and reduce the temperature of hot spots

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