Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Failure analysis method for computer mainboard

A failure analysis, motherboard technology, applied in the field of analysis, can solve problems such as large error, low precision, computer motherboard failure, etc.

Inactive Publication Date: 2012-01-11
SHANGHAI FALAB TEST
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Computer mainboards often fail due to abnormal impedance between adjacent pins that exclude resistance. Existing failure analysis of computer mainboards often uses optical microscopic observation of the appearance. This method can only initially detect failed computers. Motherboard, low precision, large error

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0016] A computer motherboard failure analysis method, it comprises the following steps:

[0017] 1) Carry out an optical inspection of the appearance of the computer motherboard to determine whether it is polluted;

[0018] 2), carry out electrical isolation test to the computer main board that judges to have pollution in step 1), judge whether it has electrical abnormality;

[0019] 3), carry out SEM / EDS analysis to the computer main board that judges to have electrical abnormality in step 2), judge whether it has conductive element;

[0020] 4), carry out ultrasonic cleaning to the computer main board that judges to have conductive element in step 3).

[0021] 5), carry out electrical isolation for the second time to the computer motherboard processed in step 4), and judge whether it still has electrical abnormality;

[0022] 6), carry out the second SEM / EDS analysis on the computer mainboard which is judged to have electrical abnormality in step 5), and judge whether it ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a failure analysis method for a computer mainboard. The failure analysis method comprises the following steps of: (1) performing optical appearance inspection on the computer mainboard to judge whether the computer mainboard is contaminated or not; (2) performing electrical isolation testing on the computer mainboard judged to be contaminated in the step (1) to judge whether electrical abnormality exists or not; (3) performing SEM / EDS (Scanning Electron Microscopy / Energy Dispersive Spectrometer) analysis on the computer mainboard judged to undergo electrical abnormality in the step (2) to judge whether electroconductive elements exist in the computer mainbody or not; and (4) performing ultrasonic cleaning on the computer mainboard judged to be with the electroconductive elements in the step (3). According to the failure analysis method for the computer mainboard in the invention, by performing optical appearance inspection, the electrical isolation testing, the SEM / EDS analysis and the ultrasonic cleaning on the computer mainboard, failure phenomena of the computer mainboard can be detected effectively and rapidly.

Description

technical field [0001] The invention relates to an analysis method, in particular to a failure analysis method, in particular to a failure analysis method for computer motherboards. Background technique [0002] Computer mainboards often fail due to abnormal impedance between adjacent pins that exclude resistance. Existing failure analysis of computer mainboards often uses optical microscopic observation of the appearance. This method can only initially detect failed computers. The main board has low precision and large error. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a method for analyzing the failure of the mainboard of the computer, which can accurately and effectively detect the failure phenomenon of the mainboard of the computer. [0004] In order to solve the above-mentioned technical problems, the present invention provides a kind of computer motherboard failure analysis method, and it comprises the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01N21/88G01R31/00
Inventor 刘学森
Owner SHANGHAI FALAB TEST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com