Heating and pressing device for anodic bonding of long glass cylinders
A technology of anodic bonding and pressurizing device, which is used in microstructure devices, manufacturing microstructure devices, decorative arts, etc., can solve the problems of difficulty in applying voltage to silicon wafers and glass columns, and achieves a convenient power-on height and ensures power-on Effects, effects that are easy to adjust
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[0021] The technical solutions in the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0022] The invention discloses a heating and powering device for anodic bonding of a long glass cylinder, which can be flexibly integrated in a single-chip anodic bonding equipment. The heating and powering device for anodic bonding of the long glass cylinder is highly adaptable , The bonding accuracy is high, which can effectively solve the problem of difficulty in applying voltage to the silicon wafer and the long glass column.
[0023] See Figure 1...
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