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Display panel module assembly device

A technology for display panels and assembly devices, which can be used in transportation and packaging, furnaces, electrical components, etc., and can solve problems such as the overall length of the device

Inactive Publication Date: 2011-11-30
HITACHI HIGH-TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the overall length of the general display panel module assembly device is very long.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0127] First, the assembly process of the display panel module will be briefly described. Figure 13 It is a figure for demonstrating the assembly process of a display panel module. The assembly of the display panel module is carried out as follows.

[0128] (a) Terminal cleaning step: a step of cleaning the peripheral terminal region of the display panel substrate 7 . Wipe and remove (45) foreign matter and the like at the terminal portion with a cleaning tape 44 dipped in a solvent or the like. As other foreign matter removal methods, methods using UV and plasma may also be employed.

[0129] (b) ACF pasting step (panel side): a step of pasting the anisotropic conductive film (ACF) on the display panel substrate 7 . The ACF 46 is softened and temporarily attached ( 47 ) to the device mounting position of the display panel substrate 7 at a temperature ranging from several tens of degrees Celsius or less to around 100 degrees Celsius.

[0130] (c) Mounting step: a step of ...

Embodiment 2

[0218] Next, Example 2 will be described.

[0219] Figure 14 This is an example for explaining the configuration of a panel mounting apparatus and a panel conveying path for mounting panels using a conventional conveying method. The figure shows the state in which the whole panel assembly apparatus is viewed from obliquely above, and the panels are assembled while being transported between the units divided in the figure. Its flow is as follows.

[0220] (1) The process of cleaning the device mounting part of the edge part (electrode part) of the display panel

[0221] (2) The process of pasting an anisotropic conductive film (ACF: Anisotropic Conductive Film) on the edge of the display panel after cleaning

[0222] (3) The process of positioning and mounting the TAB and IC with high precision at the position where the ACF is pasted

[0223] (4) The process of thermocompression bonding the mounted TAB and IC and bonding them with the previous ACF film

[0224] (5) The pr...

Embodiment 3

[0243] exist Figure 16 as well as Figure 17 In the plan view of , when the panel is carried into the panel edge processing unit 600 arranged in a "U" shape, the panel that has completed the edge processing remains in the panel edge processing unit 600; or when the panel that has completed the edge processing is carried out , When there is a display panel to be imported from the upstream, sometimes it is necessary to solve the collision between the panels, or to set a standby time on the side where the new import is to be carried out. In this case, even if the length of the device is shortened, the reduction in assembly time cannot be achieved due to the feature that simultaneous processing of the above-mentioned three sides can be realized. In addition, there is a possibility that the panel may be damaged, resulting in problems such as low reliability. Therefore, next, as Embodiment 3, the above-described Figure 16 as well as Figure 17 The method of solving the problems...

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Abstract

PURPOSE: A display panel module assembling device is provided to control a plurality of processing sides suitable for the size of each display panel substrate. CONSTITUTION: A processing panel maintenance unit(4) maintains a first display panel substrate and includes a processing unit. A first processing unit is arranged about the first processing side of the first display panel substrate. A second processing unit is arranged about the first processing unit. A third processing unit faces a second processing unit.

Description

technical field [0001] The invention relates to a mounting device for mounting electronic devices on a substrate, a heating and pressure welding device for heating and pressure-bonding electronic devices on a substrate, and a display panel module assembly device for processing a substrate and assembling a display panel. [0002] For example, it involves mounting driver ICs around display panel substrates (display element substrates) of FPD (Flat Panel Display) such as liquid crystal and plasma, and connecting so-called TAB (Tape) such as COF (Chip on Film) and FPC (Flexible Printed Circuits). Automated Bonding) and a display panel module assembly device for mounting peripheral substrates (PCB: Printed Circuit Board). [0003] More specifically, it relates to the configuration of a small, high-efficiency, and high-precision display panel module assembly device. Background technique [0004] The display panel module assembly device is a device that performs multiple processin...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L21/50H01L21/60B65G49/06
Inventor 宫坂彻油田国夫斧城淳杉崎真二渡边丰山崎不二夫
Owner HITACHI HIGH-TECH CORP
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