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Soldering apparatus

A technology for soldering and substrates, which is applied to welding equipment, assembling printed circuits with electrical components, lighting and heating equipment, etc. It can solve the problem that users cannot leave, do not have the means to notify users, and pass the alarm as a substrate falling error. It can prevent errors in curve measurement and prevent mistransmission

Active Publication Date: 2011-10-12
SENJU METAL IND CO LTD
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, the conventional reflow furnace is based on the production mode, so there is no means of notifying the user when the substrate is delivered.
Therefore, in the conventional temperature profile measurement, there is the following problem: after the substrate is put into the furnace, it is not known when the substrate will be transported out of the furnace, so the user cannot leave the reflow furnace until the substrate is transported out of the reflow furnace
In this case, there is a problem that an alarm will be reported as a substrate drop error

Method used

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Embodiment Construction

[0025] Hereinafter, the best mode for carrying out the present invention (hereinafter referred to as an embodiment) will be described.

[0026] [Structure example of reflow soldering device]

[0027] figure 1 It is a figure explaining an example of the structure of the reflow soldering apparatus 100 of this invention. The reflow soldering apparatus 100 of the present invention is characterized by having a production mode and a temperature profile mode. In the temperature profile mode, an alarm is generated before the substrate 30 transported in the main body of the reflow soldering apparatus reaches the output port 10b of the reflow soldering apparatus 100 sound.

[0028] Such as figure 1 As shown, the reflow soldering device 100 includes a reflow soldering device main body 10, a heater 12, a fan 14, a motor 16, a cooler 18, an inlet side sensor portion 20, an outlet side sensor portion 22, and a conveyor belt 34. The reflow soldering apparatus main body 10 is composed of a tunnel-...

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Abstract

The invention provides a soldering apparatus. The error transportation of a board, a measuring error and a false action of the alarming are prevented when a temperature curve of the soldering apparatus is measured. In a reflow soldering apparatus 100, when changing the operation mode from a production mode to a temperature profile mode, a warning-issue-time is set to a point of time (for example, several seconds) before the circuit board reaches an exit of the main body of the soldering apparatus to issue an alarm at this set time. A control unit calculates the alarm sound generating period based on a pre-alarm time output from the set substrate, supplies the Ready signal to a front-section device and makes the substrate standstill detection function and the substrate drop-off detection function off (S400, S410). After a sensor of entrance side has detected that the circuit board enters into main body (S420) of the reflow soldering apparatus, the control unit determines whether or not the starting time of the alarm sound has been elapsed. A reporting unit reports (S440) to the user that the substrate is approaching the vicinity of the outlet by the alarm sound when the starting time of the warning issue has elapsed.

Description

Technical field [0001] The present invention relates to a soldering device for bonding electronic components on a substrate. In detail, it relates to soldering that has at least a production mode of soldering electronic parts on a substrate and an operation mode of a temperature profile mode that measures the temperature of the substrate conveyed in the main body of the soldering apparatus. Device. Background technique [0002] In the case of soldering electronic parts on a printed circuit board, a reflow soldering device is generally used. The reflow soldering apparatus has a conveyor belt that conveys the printed circuit board and a reflow soldering device main body that conveys the printed circuit board by the conveyor belt. The inside of the main body of the reflow soldering device is divided into a preliminary heating zone, a formal heating zone, and a cooling zone. The printed circuit board pre-printed with solder paste is first preheated in the preheating zone. The pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00H05K3/34G05D23/19
CPCB23K1/0016F27B9/40H05K3/3494H05K2203/163
Inventor 太田代忠义井上裕之
Owner SENJU METAL IND CO LTD
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