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Heat sink assembly and electronic device applying the same

A technology of a heat sink and a joint, which is applied to circuits, electrical components, electrical solid devices, etc., can solve problems such as short circuits, burning electronic components, and increasing production costs, reducing material costs and assembly costs, and assembling simple and firm. Effect

Inactive Publication Date: 2011-09-28
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such clasps usually need to be manually assembled with specific tools, thus increasing production costs
And when the cooling device is in use, when the buckle is not tightly connected and falls off, it may cause a short circuit and burn the electronic components, thus affecting the working performance of the electronic components

Method used

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  • Heat sink assembly and electronic device applying the same
  • Heat sink assembly and electronic device applying the same
  • Heat sink assembly and electronic device applying the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] see figure 1 and figure 2 , which is an assembly diagram of an electronic device 100 of the present invention. The electronic device 100 includes a heat sink assembly 10 and an electronic component 20 . The heat sink assembly 10 attaches the electronic component 20 to dissipate heat from the electronic component 20 .

[0031] The heat sink assembly 10 includes a square substrate 12, four extension arms 14 extending horizontally from the four corners of the substrate 12, and four turnbuckles that cooperate with the extension arms 14 to fix the substrate 12 on the electronic component 20. Tool 16.

[0032] The substrate 12 is made of a material with good thermal conductivity, such as aluminum, copper, etc., and is used for contacting with the electronic component 20 to absorb its heat. Each of the extension arms 14 is a longitudinal elastic sheet thinner than the base plate 12. The end of each extension arm 14 is provided with a first through hole 142, and the inner ...

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PUM

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Abstract

The invention relates to a heat sink assembly, which comprises a base plate, at least one extension arm extending along the base plate, and at least one screw fastener matched with the extension arm. The extension arm is provided with at least one through hole which is used for the screw fastener to penetrate; the screw fastener comprises a pressing part and a body extending from the pressing part; an anti-drop screw thread is formed on the body; the inner wall of the through hole is provided with an inner thread matched with the anti-drop screw thread; and the anti-drop screw thread of the body is screwed with the inner thread of the through hole, passes through the through hole and then abuts on the lower side of the extension arm. The screw thread is arranged on the body of the screw fastener to prevent the screw fastener from separating from a heat conducting base plate, the heat sink assembly is simple and firm in assembly, and the material cost and the assembly cost are reduced. The invention also relates to an electronic device applying the heat sink assembly.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device combination for cooling electronic components and an electronic device using the heat dissipation device combination. Background technique [0002] With the rapid development of the computer industry, more and more heat is generated by heat-generating electronic components such as micro-processing chips. Electronic components dissipate heat. Such a thermally conductive substrate is fixed on the circuit board by means of a fixing fastener such as a screw with a screw thread at the end and the circuit board screwed together. Before the heat conduction substrate is used, screws are usually preset in the through holes of the heat conduction substrate. During transportation, in order to prevent the screws from falling off the heat-conducting substrate due to vibration and other reasons, a clasp with a diameter larger than the through hole of the heat-conducting ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/40G06F1/20
CPCG06F1/20H01L23/4006H01L2924/0002
Inventor 谢宜莳王永健
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD
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