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Multi-wire cutter special for sapphire

A multi-wire cutting machine and sapphire technology, which is applied to stone processing equipment, working accessories, fine working devices, etc., can solve the problems that the cutting quality cannot meet the application requirements, the thickness control of the cutting material is difficult to grasp, and the production cost is high. Achieve the effect of long trouble-free running time, fast net feeding speed and small cutting loss

Inactive Publication Date: 2011-09-21
唐山晶玉科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cutting process has relatively high requirements on the cutting line and the hardness of the frosting, and it is difficult to control the thickness of the cutting sheet during the cutting process
In the prior art, ordinary multi-wire cutting machines are generally used to cut sapphire. Due to the deformation of the cutting wire and the slow cutting speed, the cutting quality cannot meet the application requirements, resulting in waste of raw materials and high production costs.

Method used

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  • Multi-wire cutter special for sapphire
  • Multi-wire cutter special for sapphire
  • Multi-wire cutter special for sapphire

Examples

Experimental program
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Embodiment Construction

[0016] The present invention will be further described through the embodiments below in conjunction with the accompanying drawings.

[0017] A special multi-wire cutting machine for sapphire, including a body 1, a cutting wire mechanism 2, a swing table 3, and a lifting body 4. The swing table, the lifting body drives the swing table to move up and down, and the swing table itself swings left and right, so that the workpiece on the swing table cooperates with the cutting wire mechanism to complete sapphire multi-line cutting. Said swing workbench comprises dovetail groove workbench 5 and the stepper motor 6 connected with it, and stepper motor drives dovetail groove workbench to swing left and right. The swing workbench is also provided with a workbench shield 7, an observation window 8, a dial 9, and a scale 10. An observation window is arranged on the workbench shield, and a matching dial and scale are arranged in the observation window. Said lifting body comprises body 11,...

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PUM

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Abstract

The invention relates to a multi-wire cutter special for sapphire, which belongs to the technical field of cutting devices special for sapphire. The technical scheme is as follows: the multi-wire cutter comprises a cutter body (1), a cutting wire mechanism (2), a swing working platform and a lifting body (4), wherein the cutting wire mechanism is arranged on the upper part of the cutter body, the swing working platform is arranged at the lower part of the cutting wire mechanism, the lifting body is connected with the swing working platform and drives the swing working platform to move up and down, and the swing working platform per se swings left and right to ensure that a workpiece on the swing working platform is matched with the cutting wire mechanism so that multi-wire cutting of the sapphire can be completed. The multi-wire cutter is used for adjusting the cutting angle of the sapphire dynamically, and ensures that the angle of a sapphire material can be continuously adjusted with the swing working platform when the sapphire material is cut so that a cutting wire is in less contact with the material and additional friction force is reduced; meanwhile, the feeding speed of the cutting wire can be greatly increased, the problem of low cutting speed caused by high hardness of the sapphire is solved, and the speed is improved to 2-4 times of that of the common multi-wire cutter.

Description

technical field [0001] The invention relates to a special multi-wire cutting machine for sapphire, which belongs to the technical field of special cutting equipment for sapphire. Background technique [0002] Currently, sapphire is slower to cut due to its greater hardness. The cutting process has relatively high requirements on the cutting line and the hardness of the frosting, and it is difficult to control the thickness of the cut sheet during the cutting process. In the prior art, ordinary multi-wire cutting machines are generally used to cut sapphire. Due to the deformation of the cutting wire and the slow cutting speed, the cutting quality cannot meet the application requirements, resulting in waste of raw materials and high production costs. Contents of the invention [0003] The purpose of the present invention is to provide a special multi-wire cutting machine for sapphire, which can quickly disassemble the reel and unwind the wire, and directly unwind the cuttin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/00
Inventor 董秀建张静波姚志武姚大山张会军
Owner 唐山晶玉科技股份有限公司
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