Clamp for mixed fracture test of dual-phase material interface

Abstract

The invention belongs to the technical field of a material detection, and particularly relates to a clamp for mixed fracture test of a dual-phase material interface. The clamp is divided into an upper part and a lower part that are symmetric to each other; each of the upper part and the lower part consists of a pulling rod, a semiround plate and a sample table; the sample table is connected with the semiround plate by bolts; the semiround plate is connected with the pulling rod by a bolt; a plurality of round holes are symmetrically arranged at the edge of the semiround plate; and the upper pulling rod and the lower pulling rod are fixedly connected with an upper force-applying system and a lower force-applying system of a pulling machine respectively. The clamp can be used together with a universal mechanic tensile testing machine; a sample with a pre-crack is fixed on the clamp; subsequently the clamp can be rotated so as to apply the pull forces of different angles to the sample; the critical fracture strength of the interface crack can be calculated according to a force-displacement curve. The clamp can be used for conveniently determining the situations of the I-type mixed fracture mode and the II-type mixed fracture mode under different tensile loading angles, and is also applicable to determinine the I-type fracture situation of the dual-phase material interface.

Description

Technical field [0001] The invention belongs to the technical field of material detection, and particularly relates to a clamp used for testing the fracture strength of different material interfaces in different modes in electronic packaging. Background technique [0002] In the production and testing process of integrated circuit packages, or when the packaged devices are working in harsh environments, the delamination phenomenon of the interface of different materials often occurs. For the interface between two materials with large differences in coefficient of thermal expansion (CTE) , The stratification phenomenon is particularly serious. For example, in plastic packaged devices, the thermal expansion coefficient mismatch between PCB, Si, plastic molding compound, resin and other materials is very significant. When the package body is under the load of moisture, heat, etc., it is easy to get on the interface between these materials. Delamination fracture occurs, and delamina...

AI Technical Summary

Problems solved by technology

However, for the interface in the aforementioned electronic packaging device, the thickness of the material is very thin, and it involves brittle materials such as Si, which is not suitable for the experiment of bending mode, and it is not easy to prepare the semicircular sample required by the Brazil-nut compression method; On the one hand, the change range of the fracture phase angle of the bending method and the wedge-shaped insertion method is very small, and the law of the change of the fracture energy with the fracture phase angle cannot be obtained in a large range.

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