Heat-conducting device and electronic device using same

Abstract

The embodiment of the invention provides a heat-conducting device. The heat-conducting device comprises a first heat-conducting plate and a heat-conducting structure. The first heat-conducting plate comprises an upper heat-conducting arm arranged on the surface of the first heat-conducting plate. The heat-conducting structure and the upper heat-conducting arm of the first heat-conducting plate are slidably pressed against so as to form a contact surface and transfer heat through the contact surface. The heat-conducting structure comprises a heat-conducting surface. The heat-conducting structure is used for keeping the relative position between the first heat-conducting plate and the heat-conducting surface, is capable of changing the distance between the first heat-conducting plate and the heat-conducting surface of the heat-conducting structure by relative sliding between the upper heat-conducting arm and the heat-conducting structure and can ensure a contact surface for heat transfer between the upper heat-conducting arm of the first heat-conducting plate and the heat-conducting structure all the time. In the invention, the heat-conducting structure of the heat-conducting component capable of sliding relatively is used for compensating a manufacturing error, so the heat conductivity and reliability of the heat-conducting structure are improved.

Description

technical field [0001] The invention relates to a heat conduction device, in particular to a heat conduction device used in electronic products. Background technique [0002] In the current electronic equipment, with the continuous enrichment of functions, the corresponding power consumption is also continuously increased. At the same time, the heat dissipation problem of electronic products has become an important issue restricting the development of electronic equipment. In order to conduct the heat generated by the electronic product to the heat sink in a timely manner, a heat transfer medium is usually placed between the heat source in the electronic product and the heat sink to conduct the heat generated by the heat source in the electronic product to the heat sink. device. [0003] In the process of realizing the present invention, the inventor finds that there are at least the following problems in the prior art: [0004] Due to the existence of manufacturing errors...

AI Technical Summary

Problems solved by technology

[0004] Due to the existence of manufacturing errors, the distance between the heat source and the heat sink of the electronic product is not constant, but changes within a certain range. Most of the existing heat transfer media cannot automatically adjust to a suitable thickness to adapt to the heat source. The distance between the heat sink and the heat sink changes, which leads to a high thermal resistance between the heat source and the heat sink, and cannot achieve fast heat transfer

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