Optical module and manufacturing method thereof

A manufacturing method and optical module technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as chip function failure and packaging failure, achieve high-temperature aging without failure, reduce the probability of failure, and produce finished products rate-enhancing effect

Inactive Publication Date: 2011-05-18
CHENGDU RUIHUA OPTOELECTRONICS TECH CO LTD
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  • Abstract
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Problems solved by technology

[0007] Aiming at the difference in CTE between the chip and the substrate of the above optical modules, part of the chip functions will fail after colloid potting. Package failure caused by substrate CTE mismatch

Method used

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  • Optical module and manufacturing method thereof
  • Optical module and manufacturing method thereof
  • Optical module and manufacturing method thereof

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Embodiment Construction

[0013] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0014] A package structure of an optical module disclosed in the present invention is attached figure 1 . The optical module includes a substrate and a chip that is flip-chip-bonded with the substrate. The space between the substrate and the chip is potted with transparent silicone, and the outside of the substrate and the chip is potted with potting glue.

[0015] In potting, EXF1000 glue dispenser can be used, and the thickness of the glue is about 20-25 microns. Transparent silica gel is used for the first potting, and its model is preferably OE6551 silica gel, and its CTE is 210±100ppm / °C. After dispensing, heat the optical module in an oven, preferably to 90±5°C, and continue heating for 240 minutes, then cool natu...

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Abstract

The invention discloses an optical module, comprising a substrate and a chip welded with the substrate by adopting a flip chip bonding method, wherein the gap between the substrate and the chip is filled and sealed by transparent silica gel, and the substrate and the exterior of the chip are encapsulated by pouring sealant. The invention also discloses a manufacturing method of the optical module. In the invention, common pouring sealant is adopted, and a secondary pouring process is utilized, thus the problem of encapsulation failure caused by mismatching of CTE (coefficient of thermal expansion) of the chip and the substrate in the optical module is successfully solved.

Description

technical field [0001] The invention relates to an optical module and a manufacturing method thereof, in particular to an optical module and a chip flip-chip packaging method thereof. Background technique [0002] Flip-chip bonding (FCB) is a method of direct mounting and interconnection between chips and substrates. The chip faces down, and the pads on the chip are directly connected to the pads on the substrate. Therefore, the interconnection wire is very short, and the stray capacitance, interconnection resistance and interconnection inductance generated by interconnection are much smaller than wire bonding and tape automated bonding, which is more suitable for high Frequency, high-speed electronic products. The substrate area occupied by FCB chip mounting and interconnection is small, and the chip mounting density is high. Moreover, the chip bonding area of ​​FCB can be arranged in an area array, which is more suitable for LSI and VLSI chips with high I / O count. Since...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/29H01L21/50H01L21/56
CPCH01L2224/73204
Inventor 张宇
Owner CHENGDU RUIHUA OPTOELECTRONICS TECH CO LTD
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