Dyestripping method, dyestripping device and dyestripping equipment

Abstract

The invention discloses a dyestripping method. The dyestripping method is characterized in that film edges are separated from a substrate attached with the film edges; and a first fixture is used to clamp the film edges, and the first fixture is moved to gradually separate the film from the substrate attached with the film until the film and the substrate attached with the film are completely separated. The invention provides a novel dyestripping method which is as follows: a mechanical device is used for dyestripping in no need of using consumption materials such as tapes or films and the like, thereby reducing the use of consumable articles and effectively reducing the cost; and a dyestripping device can be recycled, thereby saving the cost of dyestripping. In the dyestripping device, dyestripping operation is simple and practicable, the success rate is high, the film on a wafer can be safely torn, thus the phenomenon that the tape can not be adhered with the film so that the film can not be torn is not occur; in the process of dyestripping, the operation of parts in the dyestripping device is easy to control, the precision is easy to handle, and the wafer can not be touched by the dyestripping device, thereby effectively avoiding the wafer is damaged and ensuring the safety of the wafer; and the dyestripping process is safe and reliable.

Description

technical field [0001] The invention relates to a film tearing method, a film tearing device and film tearing equipment. Background technique [0002] After the wafer production is completed, packaging and testing are required. Wafer production and packaging testing are often performed by different companies, therefore, need to be transported between different locations. In consideration of the safety of wafers during movement, the thickness of wafers manufactured by fabs is usually above 700um to prevent breakage during transfer. And as the size of the wafer increases, its thickness gradually increases. However, in the application of wafers, the development trend of chips is getting thinner and thinner. Therefore, before packaging and testing, the wafer needs to be thinned. [0003] Usually, the circuit side of the wafer, that is, the side that completes the chip function, is called the front side, and the other side is the back side. The back side of the wafer is main...

AI Technical Summary

Problems solved by technology

[0007] 1. Tape is consumed every time the film is torn off

Adhesive tapes currently available in the market are more expensive, increasing the cost

Moreover, the tape cannot be recycled, and it will be discarded after one use, which not only costs high, but also produces garbage that is difficult to dispose of

[0008] 2. It is difficult to tear the film

Since the side of the thinning film that is not in contact with the wafer will be exposed to the air, anti-adhesive treatment is performed to prevent dust from sticking to it, and when the film is torn off, the adhesive tape and the thinning film are required to be stronger. These two requirements are mutually exclusive. Paradoxically, although the adhesion between the film and the wafer is not very strong, the adhesion between the tape and the film cannot be guaranteed to be successful every time because the back of the film is anti-adhesive. tear-off film

[0009] 3. Affect the security of the wafer

[0010] 4. Affect the quality of cutting film

For some types of thinning film, it needs to be heated to a certain temperature to be removed more reliably, which will cause the cutting film to be heated together, which will affect the quality of the cutting film and have a negative impact on the subsequent process

[0011] 5. Affect production efficiency

[0013] Although this method can change the dependence on the tape and partially reduce the cost of the tape, it does not fundamentally solve the problem of tape tearing

Firstly, the plastic film is still a consumable; secondly, the success rate is relatively low; thirdly, not every kind of thin film can be welded together with the plastic film; fourthly, the temperature, pressure and position of the heat welding need to be precisely controlled. It is difficult not to affect the dicing film and wafer

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